WMSIC Electronic Components

VRB1205YMD-10WR3

ModelVRB1205YMD-10WR3
PackageDIP
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC VRB1205YMD-10WR3
Type
YLPTEC
Minimum package
10 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
VRB1205YMD-10WR3
Electronic Component
1
Electronic Component
25.4mm
Package
DIP
Electronic Component
Isolated Power Supply Module
Electronic Component
15.745g
Electronic Component
25.4mm
Electronic Component
11mm
Electronic Component
1
Electronic Component
BM0265023124
Operating Temperature
40℃~+85℃
Switching Frequency
250kHz
Electronic Component
50mVp-p
Conversion
85%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VRB1205YMD-10WR3 产品概述

一、产品概述

VRB1205YMD-10WR3 是 YLPTEC(易川) 推出的一款高可靠性、单通道 10W 隔离型 DC-DC 模块。模块输入为 2:1 宽电压范围(9V–18V),输出为 5V/2A,适合在工业级与严苛环境下长期稳定工作。产品体积小巧(25.4 × 25.4 × 11 mm,DIP 封装),隔离电压达到 1500VDC(1.5kV),工作温度范围宽(-40℃ 至 +85℃),并具备多重保护功能,适用于医疗、工控、电力、仪器仪表、通信与轨道交通等领域。

二、主要电气参数

  • 输出通道数:1 路
  • 输出功率:10W(最大)
  • 输入电压 Vin:9V ~ 18V(2:1 宽输入)
  • 输出电压 Vout:5V
  • 输出电流(最大):2A
  • 转换效率:典型 85%,峰值可达 91%(视工况而定)
  • 开关频率:250kHz
  • 纹波噪声:50 mVp-p(典型)
  • 最大容性负载:2200 µF

三、保护与兼容性

  • 保护功能:输入欠压保护(UVLO)、输出过压保护(OVP)、过流保护(OCP)与短路保护(SCP),确保负载异常时模块自我保护并可自动恢复或限流输出。
  • EMI/EMC:裸机状态满足 CISPR32 / EN55032 Class A 要求,方便在经过适当滤波与屏蔽后的系统中达到更高电磁兼容性指标。
  • 隔离性能:常规隔离电压 1500VDC,适合需要安全与功能隔离的场合。

四、机械与环境特性

  • 尺寸:25.4 mm × 25.4 mm × 11 mm(DIP 封装),便于插装或焊接在标准 PCB 上。
  • 工作温度:-40℃ 至 +85℃,适应工业与室外环境。
  • 散热与布局:模块功率密度高,建议在设计 PCB 时保证良好散热路径与较大铜箔面积,避免长期满载下高温影响可靠性。

五、应用建议与注意事项

  • 输出滤波:为保证低纹波与系统稳定,输出端建议并联低 ESR 电解或固态电容,单个电容不超过模块规格所允许的最大容性负载(2200 µF)。
  • 输入侧滤波:为抑制开关干扰,输入端建议加装变换前的 LC 滤波或磁珠,并注意滤波组件的耐压与温升。
  • 布局与接地:高频开关器件对布局敏感,输入输出走线应尽量短、粗,接地应采用单点或固体回流,避免噪声耦合到敏感信号。
  • 散热与老化:长时间在高温与高负载工作时应考虑适当降额使用(如 80% 额定负载),以提高寿命与可靠性。

六、典型应用场景

适用于需要隔离与小体积电源解决方案的场合:医疗设备、工业控制系统、通信基站、仪器仪表、配电与能源设备、铁路与交通控制等领域,尤其适合对电气隔离与抗干扰有较高要求的系统。

如需更详细的电气特性曲线、典型应用电路或器件选型建议,可提供系统应用场景与 PCB 布局图,便于给出更精确的集成与调试方案。

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