WMSIC Electronic Components

TAXM8M4RDBCCT2T

ModelTAXM8M4RDBCCT2T
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TAXM8M4RDBCCT2T
Type
YJX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TAXM8M4RDBCCT2T
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.05g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0225221364
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
10pF
Frequency
±15ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAXM8M4RDBCCT2T无源贴片晶振产品概述

一、产品基本信息

TAXM8M4RDBCCT2T是雅晶鑫(YJX) 推出的无源贴片晶振,属于工业级通用时钟参考器件。核心特征如下:

  • 类型:无源晶振(需外接负载电容实现起振,无内置振荡电路)
  • 封装:SMD3225-4P(尺寸3.2mm×2.5mm,4引脚表面贴装,适合小型化设计)
  • 型号标识:“TAXM”为雅晶鑫无源晶振系列代号,“8M”代表8MHz频率,“4RDBCCT2T”为具体规格编码

二、核心性能参数

该晶振的关键参数匹配中低速电子设备的时钟需求,具体如下:

  1. 频率规格:8MHz(常用MCU、微处理器的基准时钟频率,覆盖多数嵌入式系统)
  2. 常温频差:±10ppm(即8MHz±80Hz,满足一般电子设备的频率精度要求)
  3. 负载电容:10pF(无源晶振的核心匹配参数,需外接电容实现,否则频率会偏移)
  4. 频率稳定度:±15ppm(包含温度、电压波动的综合频率变化,覆盖全工作温度范围)
  5. 等效串联电阻(ESR):250Ω(ESR值合理,多数MCU的时钟驱动电路可稳定起振)
  6. 工作温度:-40℃~+85℃(工业级温度范围,适应户外、车载等恶劣环境)

三、典型应用场景

由于工业级温度范围和8MHz通用频率,该晶振广泛应用于以下领域:

  1. 工业控制:PLC可编程逻辑控制器、传感器模块、工业物联网节点(适应车间/户外-40~+85℃环境)
  2. 通信终端:LoRa、蓝牙低功耗(BLE)模块、NB-IoT终端(8MHz匹配低速通信协议)
  3. 消费电子:智能插座、加湿器控制板、智能穿戴(手表/手环MCU时钟)
  4. 车载电子:辅助驾驶传感器、车载信息娱乐系统辅助时钟(符合车载工业级要求)
  5. 医疗设备:便携式监护仪、小型血糖检测仪(频率稳定度满足医疗精度需求)

四、选型与设计注意事项

为保证晶振性能稳定,需注意以下要点:

  1. 负载电容匹配:必须采用10pF等效负载电容,通常在晶振两个引脚各接1个20pF陶瓷电容(并联后等效负载电容≈10pF,忽略晶振分布电容);若电容偏差过大,会导致频率偏离规格。
  2. 起振条件验证:ESR=250Ω需确认MCU的时钟振荡器(OSC)驱动能力足够——主流MCU(如STM32、ATmega系列)的OSC增益可满足此ESR的起振要求。
  3. 温度范围适配:仅支持-40℃~+85℃,不可应用于+100℃以上高温环境,否则频率稳定度会超差。
  4. 焊接工艺:SMD3225封装需用回流焊,焊接峰值温度245℃±5℃、时间≤30s,避免高温损坏晶振。

五、品牌与品质保障

雅晶鑫(YJX)是国内专业晶振制造商,TAXM8M4RDBCCT2T系列具备以下优势:

  • 符合RoHS2.0环保标准,无有害物质;
  • 批量生产一致性好,参数离散性小;
  • 经过高低温循环、振动、冲击测试,满足工业级长期稳定性;
  • 供货周期稳定,支持样品及大批量订单,适合研发与量产选型。

该晶振以高性价比和工业级可靠性,成为中低速电子设备时钟参考的优选器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.