WMSIC Electronic Components

TXM24M0004322FBCDO00T

ModelTXM24M0004322FBCDO00T
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TXM24M0004322FBCDO00T
Type
YJX
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TXM24M0004322FBCDO00T
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.05g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0263522157
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TXM24M0004322FBCDO00T 贴片晶振产品概述

一、产品核心定位与应用场景

TXM24M0004322FBCDO00T是雅晶鑫(YJX)推出的24MHz通用型贴片石英晶体谐振器,专为需要高精度时序基准、宽温适应性的电子设备设计,属于工业级与商用兼顾的主流晶振产品。其核心定位覆盖三大场景:

  • 消费电子:智能手机主板、平板显示时序控制、便携式音频设备等;
  • 工业控制:PLC可编程控制器、智能传感器、工业物联网网关等;
  • 通信网络:路由器、交换机、4G/5G小基站的时钟同步模块等。
    该晶振可直接匹配多数MCU(如STM32、ATmega系列)、FPGA及通信芯片的时钟输入,无需额外分频/倍频,是降低系统设计复杂度的理想选择。

二、关键性能参数详解

  1. 标称频率与精度:24MHz是行业应用最广泛的基准频率之一,常温频差±10ppm(即频率偏差≤240Hz),满足高清显示、数据采集同步等对时序精度要求较高的场景;
  2. 负载电容:12pF为行业标准值,多数集成芯片的晶振引脚内置匹配电容接近该值,可直接兼容使用,无需额外并联电容调整,简化电路设计并降低BOM成本;
  3. 全温频率稳定度:±20ppm(-40℃~+85℃范围内频率漂移≤480Hz),结合低ESR特性,保证宽温环境下振荡稳定性,避免因温度变化导致的频率失锁;
  4. 等效串联电阻(ESR):30Ω属于低阻水平,低ESR意味着振荡电路起振更快、功耗更低,尤其适合电池供电的便携式设备,可有效延长续航时间。

三、封装与工艺特点

采用SMD3225-4P封装(尺寸3.2mm×2.5mm×0.8mm),具有以下优势:

  • 小型化设计:适配高密度PCB布局,适合智能手机、小型通信模块等对空间要求严格的设备;
  • 自动化贴装:4引脚贴片封装可直接用于SMT生产线,贴装效率高,良率稳定;
  • 工艺可靠性:采用石英晶体谐振器工艺,通过高精度光刻、镀膜及封装技术,确保晶体机械稳定性与频率一致性;4引脚设计减少寄生电容影响,进一步提升频率稳定性。

四、工作环境适应性

工作温度范围覆盖**-40℃~+85℃**,满足工业级设备的环境要求:

  • 可在户外PLC、智能传感器等极端温度场景下稳定运行;
  • 兼容部分车载辅助系统(如信息娱乐模块)的温度需求;
  • 结合±20ppm的频率稳定度,避免因温度突变导致的振荡停止或时序偏差,保证设备连续可靠工作。

五、品牌与可靠性保障

雅晶鑫(YJX)作为国内晶振领域的专业厂商,该产品经过严格可靠性测试:

  • 老化测试:连续工作1000小时以上,频率漂移≤5ppm;
  • 环境测试:高低温循环(-55℃+125℃)、振动(102000Hz)、冲击(1000g)测试均符合行业标准;
  • 环保认证:符合RoHS标准,无铅焊接兼容,满足欧盟及国内环保法规要求;
  • 供货稳定:支持批量定制,可提供样品测试与技术支持。

六、选型与应用注意事项

  1. 负载电容匹配:确认电路中晶振引脚的等效负载电容是否接近12pF,差异较大时需并联匹配电容(如10pF+2pF);
  2. 焊接工艺:回流焊峰值温度≤260℃,回流时间≤30秒,避免过热导致晶体性能下降;
  3. ESR验证:振荡电路需保证反馈增益与30Ω ESR匹配,可通过示波器观察正弦波幅度(≥0.5Vpp)确认起振;
  4. 存储条件:未使用晶振需存储在常温(15℃~35℃)、干燥(湿度≤60%)环境,避免机械冲击与静电损伤。

该产品凭借高精度、宽温适应性及小型化设计,成为工业控制、消费电子及通信领域的高性价比时钟基准方案,可满足多数中高端设备的时序需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.