WMSIC Electronic Components

YANGJIE YJQ35N04A

ModelYJQ35N04A
PackageDFN3333-8L
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE YJQ35N04A
Type
DFN3333-8L
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
YJQ35N04A
Electronic Component
1
Package
DFN3333-8L
Electronic Component
0.119g
Electronic Component
1
Electronic Component
BM0228719278
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YJQ35N04A 产品概述

YJQ35N04A 是扬杰(YANGJIE)推出的一款高性能 N 沟道功率 MOSFET,面向中低压高电流开关应用。器件在宽温度范围内稳定工作(-55℃ ~ +150℃),具备低导通电阻、较大的连续漏极电流能力和适度的开关能量,是开关电源、同步整流和直流电机驱动等系统的理想选择。

一、主要性能参数

  • 类型:N 沟道 MOSFET(单片,数量:1)
  • 漏源电压 Vdss:40 V
  • 连续漏极电流 Id:35 A
  • 最大耗散功率 Pd:40 W
  • 导通电阻 RDS(on):6.5 mΩ @ VGS = 10 V, ID = 20 A
  • 门阈电压 VGS(th):2.5 V(典型,导通阈值)
  • 总栅极电荷 Qg:46.7 nC @ VGS = 10 V(影响驱动能量)
  • 输入电容 Ciss:1.86 nF @ 20 V(影响上升/下降时间)
  • 反向传输电容 Crss:205 pF @ 20 V(影响开关交越损耗)
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:DFN 3.3 x 3.3 mm(小型化表面贴装)

二、突出特点与设计价值

  • 低导通电阻:6.5 mΩ 的 RDS(on) 在高电流条件下有利于降低导通损耗,提升转换效率,适用于要求能效的应用场合。
  • 宽温度耐受:器件可在严苛温度环境下工作,适合工业级和汽车电子(非 AEC 标注需另检)等应用。
  • 紧凑封装:DFN 3.3×3.3 的小尺寸便于高密度 PCB 布局,节省空间但需要良好散热铺铜。
  • 平衡的开关特性:Qg 和 Ciss 提示需要中等驱动能力的门驱动器;合理匹配驱动器与阻尼可在开关损耗与电磁干扰之间取得平衡。

三、典型应用场景

  • 同步整流与降压(buck)转换器:低 RDS(on) 有助于降低导通损耗,提高效率。
  • DC-DC 转换模块和开关电源:适合 12 V/24 V 及类似总线的中低压电源设计。
  • 电机驱动与驱动桥臂:单片 N 沟道适用于高电流开关场合,配合理想的散热。
  • LED 驱动、功率管理、负载开关与热插拔电路。

四、封装与热管理建议

  • 虽然 DFN 小型化便于布局,但热阻比大封装高。建议在 PCB 下方和周围尽量使用大面积敷铜与多层过孔导热,形成低热阻的散热路径。
  • 在大电流工况或高环境温度下,应进行功率损耗计算并适当降额(derating),必要时增加散热增强(散热片或底层大铜箔)。
  • 焊盘设计应遵循厂方封装推荐模板,确保焊接牢固与良好热传导。

五、驱动与开关注意事项

  • 推荐门驱动电压为 10 V 以获得标称 RDS(on)。VGS(th)=2.5 V 为阈值参数,阈值附近电流非常有限,不建议仅用逻辑电平驱动器长期在阈值上工作。
  • 总栅极电荷 Qg=46.7 nC 表示在高频开关时门驱动器需提供较大电流脉冲以快速切换,驱动损耗与开关损耗需在系统功耗预算中考虑。
  • 反向传输电容较大(Crss=205 pF),在高 dv/dt 及同步切换时会产生交越能量,建议在桥臂设计中加入死区控制或软关断、合适的门阻以降低振铃与 EMI。
  • 内置体二极管具有基本续流功能,但在高频或高应力反向恢复条件下可能产生较大能量损耗,必要时考虑并联快速恢复二极管或使用同步整流技术。

六、可靠性与选型建议

  • 器件适合需要高效率与高电流密度的应用,但在设计时应基于实际 PCB 散热能力、工作频率和负载周期进行热仿真与寿命评估。
  • 在苛刻环境(高温、高湿、振动)下使用时,建议做整机级可靠性验证并考虑电气和热降额策略。
  • 选择门驱动器和保护电路(过流、过温、短路保护)以保证系统稳定运行并保护 MOSFET。

总结:YJQ35N04A 以 40 V 电压等级、35 A 电流能力及 6.5 mΩ 低 RDS(on) 的特性,在小型 DFN 封装下提供较高的功率密度,适合多种中低压高效率电源与驱动场景。合理的驱动、良好的 PCB 热设计与保护措施是发挥其性能的关键。

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