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BLUE ROCKET BAW56
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BLUE ROCKET BAW56
- Type
- BLUE ROCKET
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BLUE ROCKET
- Electronic Component
- BAW56
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0226538736
- Current
- 215mA
- Diode
- 1
- Current(Ir)
- 30nA@25V
- (Vf)
- 1.25V@150mA
- Power Dissipation(Pd)
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAW56（BLUE ROCKET）产品概述
一、主要规格概要
- 二极管配置：1对共阳极（双二极管，公共阳极）
- 正向压降：Vf = 1.25V @ If = 150mA
- 直流反向耐压：Vr = 75V
- 整流电流（平均）：I_F(AV) ≈ 215mA
- 功耗：Pd = 250mW
- 反向电流：Ir = 30nA @ Vr = 25V（典型）
- 反向恢复时间：Trr = 4ns（快速恢复）
- 非重复峰值浪涌电流：Ifsm = 4A（瞬态）
- 封装：SOT-23（小型贴片封装）
- 品牌：BLUE ROCKET
二、产品特性与优势
- 高速开关：4ns 的反向恢复时间使其适用于高频开关与脉冲信号处理。
- 低漏电：25V 下 30nA 的微小反向电流有利于低功耗与高阻态保持。
- 中等电流能力：215mA 的整流电流适合小功率整流与信号整形应用。
- 抗冲击能力：4A 的非重复峰值浪涌能力能承受短时电流冲击。
- 小体积：SOT-23 封装便于高密度PCB布局与自动化贴装。
- 双二极管共阳极配置，便于做双路整流/抽取或电平译码等电路设计。
三、典型应用场景
- 高速开关电路与脉冲整形
- 小功率整流、信号二极管隔离与整合（steering/ORing）
- 数字逻辑保护、钳位电路与反相保护
- 峰值检波、交流信号检测与小信号放大前的整流
- 要求低漏电和快速响应的便携设备与通信前端
四、PCB 布局与热管理建议
- 封装功耗 Pd = 250mW，应考虑环境温度与铜箔散热：在较高电流工作点（如接近150mA）时，耗散功率接近 187.5mW（Vf×If），需留有余量并做热沉铜箔。
- 使用较大焊盘和加宽地/电源铜层以改善散热，避免长时间在极限功率下工作。
- 对于冲击电流，保证走线和焊盘能承受瞬态热应力；若出现频繁浪涌，建议选用更高功率件。
五、可靠性与使用注意
- 反向电压不得长期超过 75V，工作中注意浪涌与瞬态过压保护。
- 虽有 4A 的非重复峰值能力，但为保证寿命应避免频繁大电流冲击。
- 对ESD敏感，贴片期间遵循静电防护规范。
- 设计时参考厂家完整数据手册核实引脚排列、典型特性曲线和温度范围。
六、选型与替代建议
- 若需要更低正向压降或更高平均电流/功耗，应选更大封装或功率二极管。
- 若频繁处于高频或射频前端，核对器件结电容及频率响应以确定适配性。
- 采购时以BLUE ROCKET原厂资料为准，注意批次与封装标识以免混淆。
如需，我可以根据您的电路工作电压、工作频率和热条件，帮您做更精确的功耗估算与替代器件推荐。
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