WMSIC Electronic Components

CJ CJAC100SN08U

ModelCJAC100SN08U
PackagePDFNWB5x6-8L-B
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ CJAC100SN08U
Type
CJ
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
CJAC100SN08U
Electronic Component
1
Package
PDFNWB5x6-8L-B
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.195g
Electronic Component
1
Electronic Component
BM0227330803
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
104W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
80V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CJAC100SN08U 产品概述

CJAC100SN08U是一款高性能80V N沟道功率MOSFET,面向中高压开关和功率转换场景设计。器件在VGS=10V时具有极低导通电阻,配合较高的连续漏极电流能力和适中的开关电容特性,适合要求低导损与高电流通道的应用。

一、核心特性

  • 漏源电压 Vdss:80V
  • 导通电阻 RDS(on):3.9 mΩ @ VGS=10V
  • 连续漏极电流 Id:100A(器件极限,受封装与PCB散热限制)
  • 总耗散功率 Pd:104W(典型室温基准)
  • 栅极电荷 Qg:60 nC @ VGS=10V(门极驱动功率需考虑)
  • 输入/输出/反向传输电容:Ciss=3.78 nF、Coss=1.8 nF、Crss=25 pF
  • 阈值电压 Vgs(th):4 V @ ID=250 μA
  • 工作温度范围:-55 ℃ 至 +150 ℃
  • 器件类型:N沟道 MOSFET,封装:PDFNWB5x6-8L-B
  • 品牌:CJ(江苏长电/长晶)

二、电气与热参数要点

  • 在VGS=10V驱动下可获得最低RDS(on),建议门极驱动电压以10V为目标;Vgs(th)=4V表明器件并非严格“低压逻辑级”,在5V或以下驱动时导通性能受限。
  • Qg=60 nC提示高频切换时栅极驱动损耗不可忽视,驱动器需具备足够瞬时电流能力或采用合理的驱动策略(驱动电容管理、门极限流电阻等)。
  • Coss和Crss决定开关过渡过程中的能量转换与电压应力,合适的能量吸收与缓冲电路(如RC吸收、TVS)能提升系统可靠性。
  • Pd=104W为器件在理想散热条件下的额定耗散,实际应用需依据PCB铜层、过孔散热与环境温度重新评估允许电流与温升。

三、典型应用场景

  • 同步整流与降压DC-DC输出级(需低RDS(on)以降低导通损耗)
  • 服务器、电信与工业电源开关器件
  • 电机驱动逆变器的低侧或高侧开关(配合合适驱动)
  • 车载辅助电源与48V/汽车电子高压边的功率开关(80V耐压提供余量)

四、封装与散热建议

  • PDFNWB5x6-8L-B封装具备较好的平面散热路径,建议在PCB上设计大面积散热铜箔并使用多盏热导过孔以提升热阻性能。
  • 焊盘设计应遵循厂家封装应用说明,保证良好焊接与接触,避免单点热积聚。
  • 在高电流应用下,建议进行热仿真并在实际温升测试条件下确认允许电流。

五、使用注意与选型建议

  • 由于Vgs(th)相对较高,避免在低压门极驱动下长期工作;若采用驱动芯片,需评估其峰值驱动电流与持续损耗。
  • 高频切换时注意栅极驱动能量(Qg)与Coss带来的开关损耗;必要时使用软开关或缓冲网路降低开关应力。
  • 对于抗浪涌与过压场景,建议增加适当的RC、TVS或吸收网络,保护器件免受瞬态冲击。
  • 选型时结合系统功率、散热资源与工作频率综合评估,必要时参考CJ提供的数据手册与封装文档以获取完整电气和热模型数据。

如需更详细的电气特性图、典型波形或封装焊盘建议,请提供数据手册或确认是否需输出参考电路与PCB布局示意。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.