WMSIC Electronic Components

CJ BZX584C16

ModelBZX584C16
PackageSOD-523
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BZX584C16
Type
CJ
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
BZX584C16
Electronic Component
1
Package
SOD-523
Electronic Component
Zener Diode
Electronic Component
0.01g
Electronic Component
1
(Zzk)
200Ω
(Zzt)
40Ω
Electronic Component
BM0227654046
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
150mW
Electronic Component
15.3V~17.1V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX584C16 产品概述

一、概述

BZX584C16 为独立式稳压二极管(齐纳二极管),属常见的 BZX584 系列小封装稳压器件,由 CJ(江苏长电/长晶)生产,封装形式为 SOD-523。器件标称稳压值约为 16V(典型 16.2V),在实际生产批次中的稳压范围为 15.3V ~ 17.1V。凭借体积小、漏电低、耐温宽等特性,适合用于低功耗电压基准、信号/浪涌钳位与简单电源稳压场合。

二、主要电气参数

  • 标称稳压值:16V(典型 16.2V),工作范围 15.3V ~ 17.1V。
  • 反向电流 Ir:100 nA(测量点 12V),表现出较低的漏电特性,适合对静态电流敏感的电路。
  • 静态阻抗 Zzk:200 Ω;交流阻抗 Zzt:40 Ω(分别反映不同工作点下的阻抗特性),指示在稳压工作时的动态响应和纹波抑制能力。
  • 最大耗散功率 Pd:150 mW(SOD-523 小封装受限的功耗能力),需要按环境温度和散热条件进行功率降额。
  • 工作结温范围:-55 ℃ ~ +150 ℃,适合较宽温度场合的长期可靠性要求。

三、封装与热性能

SOD-523 为超小型表面贴装封装,适合高密度 PCB 布局与消费电子类微型电路。由于封装体积小,热阻较高,实际使用中应注意:

  • 在高环境温度或连续大电流情况下,需限制器件的反向电压与工作电流以避免超额功耗。
  • 采用良好散热的 PCB 设计(加大铜箔、注重热过孔/散热层)可延长可靠工作区间。

四、典型应用场景

  • 低功耗电压基准:作为简单稳压参考源,用于 ADC 参考、传感器供电等场合。
  • 信号/端口保护:钳位过压、保护敏感输入(例如微控制器 IO、模拟前端)。
  • 简易电源稳压:在小电流、低功耗模块中替代更复杂的稳压方案。
  • 浪涌抑制与温度较宽容的工业电子设备。

五、选型建议与注意事项

  • 功率与散热:Pd=150 mW 为器件极限值,建议在实际设计中留有安全裕度,必要时选择更高功耗封装或并联/替代方案。
  • 稳压精度与温漂:系列稳压范围表明器件有一定批次与温度漂移,若需高精度参考,应选用专用基准源或进行温度补偿。
  • 漏电与测试条件:Ir=100 nA 为 12V 测试点下的典型值,实际工作电压接近稳压值时漏电可能有所变化,设计中应考虑漏电对功耗和偏置的影响。
  • 环境与可靠性:SOD-523 小封装在焊接与装配时注意温度曲线,避免超温;长期在极端环境下工作建议做加速老化验证。

六、常见电路接法与实用提示

  • 作为参考源时,常将稳压二极管反向并联在负载侧,串联限流电阻以确保工作电流处于稳压区。
  • 用作钳位时,二极管并联到被保护节点,当电压超过稳压值时吸收浪涌能量。
  • 调试时测量稳压点应在稳定热态下进行,以获得真实稳压特性。

总结:BZX584C16(SOD-523,CJ)以其微小封装、低泄漏和宽温度适应性,适合用于空间受限且功耗要求较低的稳压与保护方案。设计时重点关注封装散热能力与稳压工作点的电流限制,以保证长期稳定可靠。

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