WMSIC Electronic Components

CJ BZX584C3V9

ModelBZX584C3V9
PackageSOD-523
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BZX584C3V9
Type
CJ
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
BZX584C3V9
Electronic Component
1
Package
SOD-523
Electronic Component
Zener Diode
Electronic Component
0.011g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
90Ω
Electronic Component
BM0227654061
Diode
1
Current(Ir)
3uA@1V
Power Dissipation(Pd)
150mW
Electronic Component
3.7V~4.1V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX584C3V9 产品概述

一、产品简介

BZX584C3V9 为 CJ(江苏长电/长晶)出品的独立式稳压二极管(Zener diode),标称稳压值 3.9V,实际稳压值范围为 3.7V 至 4.1V。器件采用微型 SOD-523 表面贴装封装,适合空间受限、对功耗要求较低的电子产品中作为基准电压源或过压保护元件使用。

二、电气参数

  • 标称稳压(Vz):3.9V(范围 3.7V~4.1V)
  • 反向电流(Ir):3 μA @ 1.0V
  • 耗散功率(Pd):150 mW(环境与焊接工艺影响散热能力,请按实际温升评估)
  • 阻抗:Zzt = 90 Ω;Zzk = 600 Ω(分别反映在规定测试点的动态与低电流区阻抗特性)
  • 工作结温范围(Tj):-55℃ ~ +150℃

三、主要特性

  • 小型表贴封装(SOD-523),便于高密度贴装与自动化生产。
  • 低功耗设计,Pd=150mW,适用于小电流稳压与参考源场合。
  • 低反向漏电流(3 μA @ 1.0V),有利于待机或低功耗电路的电流预算。
  • 较宽的工作温度范围,适用于工业温度等级的产品设计。

四、典型应用

  • 低功耗电源参考与基准电压源。
  • 输入端或信号线的小功率过压/钳位保护。
  • 模拟电路中电平偏置、参考稳压单元。
  • 移动设备、物联网终端、传感器节点等空间受限场合。

五、封装与热管理

SOD-523 为微小封装,热阻相对较高,器件的最大耗散功率受 PCB 散热条件限制。实际电路设计中应:控制稳压二极管上的功率损耗,留足焊盘铜箔面积以改善散热,避免在高环境温度或连续高电流条件下长期工作导致结温超过规格。

六、使用建议与注意事项

  • 选择工作电流时考虑阻抗特性,低电流下稳压精度会下降(Zzk 较大)。
  • 在并联使用时注意电流均分问题;若需更高功率请采用功率更大的封装或外部散热措施。
  • 焊接工艺应符合 SMD 焊接规范,避免过热损伤器件。
  • 设计时预留容差空间,参考器件稳压范围(3.7V~4.1V)以满足电路精度要求。

七、品牌与质量保证

CJ(江苏长电/长晶)为国内知名半导体制造商,产品覆盖广泛的二极管与分立器件系列。BZX584C3V9 在规格、出货一致性与可追溯性方面满足常规工业与消费电子应用的需要,如需批量采购建议与供应商确认器件的版本与检验报告。

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