Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ MMSZ5247B
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ MMSZ5247B
- Type
- CJ
- Minimum package
- 3000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- MMSZ5247B
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.18g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 19Ω
- Electronic Component
- BM0228197312
- Diode
- 1
- Current(Ir)
- 100nA@13V
- Power Dissipation(Pd)
- 350mW
- Electronic Component
- 16.15V~17.85V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMSZ5247B（CJ）—— 17V 独立式稳压二极管产品概述
一、产品简介
MMSZ5247B 是江苏长电/长晶（CJ）提供的独立式稳压（二极管）器件，标称稳压值 17V，实际稳压范围 16.15V ～ 17.85V。器件采用 SOD-123 表面贴装封装，适合空间受限的电路板上实现小功率的基准与稳压功能。工作结温范围宽 (-55 ℃ ～ +150 ℃)，适用于工业级环境。
二、主要参数与含义
- 标称稳压值：17V（范围 16.15V ～ 17.85V），用于参考和小功率稳压节点。
- 最大耗散功率 Pd：350 mW，指器件在适当散热条件下可持续承受的最大耗散。
- 动态阻抗：Zzk = 600 Ω（低电流区），Zzt = 19 Ω（在测试电流下），表明在较高工作电流时稳压性能明显优于极小电流时。
- 反向漏流 Ir：100 nA @ 13V，漏电流极小，有利于精密基准和高阻态下的稳定性。
- 工作结温：-55 ℃ ～ +150 ℃，适合工业级温度范围。
三、封装与热管理
SOD-123 小型封装利于表贴组装，但散热能力受限。由于 Pd 为 350 mW，常用建议：
- 持续工作时做适当降额（例如建议持续使用不超过额定 Pd 的 50%），以延长寿命并降低结温。
- PCB 布局上用较宽的铜箔、短走线并可增加热沉或多层接地/电源平面以改善散热。
- 对于峰值或瞬态高功耗情况，应设计外部限流或采用功率更高的稳压方案。
四、典型应用场景
- 作为 17V 的参考电压源或基准电路（偏置、采样电路）。
- 低功耗电路中的稳压/箝位与过压保护。
- 信号链与模拟前端中用于建立偏置点或保护敏感器件免受反向大电压。
五、选型与使用建议
- 计算串联限流电阻时，先估算所需稳流 Iz，并保证 Vz × Iz < Pd。例如：Pd = 350 mW → 理论最大 Iz ≈ 350 mW / 17 V ≈ 20.6 mA；为可靠起见可降额到约 10 mA。
- 串联电阻 R = (Vin − Vz) / Iz，选用时同时考虑负载电流变化对 Iz 的影响，确保在极限工况下器件不超过 Pd。
- 若电路对稳压精度要求高，推荐工作在 Zzt 指定的测试电流附近以获得较低的动态阻抗和更稳定的 Vz。
六、注意事项与检验
- 在实际应用前请参考 CJ 官方完整 Datasheet 获取测试电流、温度漂移系数与典型特性曲线。
- 焊接工艺应符合 SOD-123 的温度/时间限制，防止封装或内部结构受损。
- 成品检验建议做稳压值、漏电流及功耗试验，并在高低温循环下验证长期稳定性。
此器件以其小型封装、低漏电与中等功率耗散特性，适合做空间受限的中低功率稳压与参考应用。选择与使用时务必结合实际电流、散热条件与温度环境进行合理设计与降额。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
