WMSIC Electronic Components

CJ BZT52B15S

ModelBZT52B15S
PackageSOD-323
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BZT52B15S
Type
CJ
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
BZT52B15S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.037g
Electronic Component
1
(Zzk)
200Ω
(Zzt)
30Ω
Electronic Component
BM0230080073
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
200mW
Electronic Component
14.7V~15.3V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52B15S 稳压二极管(CJ,SOD-323)产品概述

一、产品简介

BZT52B15S 是江苏长电(CJ)生产的一款小功率硅稳压二极管,封装为 SOD-323 贴片形式。该型号标称稳压值 15V,稳压范围 14.7V~15.3V,适用于空间受限、功耗较低的基准稳压与浪涌钳位场合。二极管为独立式配置,单管使用方便,便于在低电流条件下实现简单可靠的电压稳定。

二、主要电气参数

  • 标称稳压:15V(范围 14.7V~15.3V)
  • 反向电流 Ir:100nA(典型低泄漏,注意测量条件)
  • 耗散功率 Pd:200mW(额定值,需按环境温度降额)
  • 结温范围 Tj:-55℃ ~ +150℃
  • 稳压阻抗 Zzt:30Ω(稳压工作区动态阻抗)
  • 楔形/拐点阻抗 Zzk:200Ω(低电流区“膝”区阻抗)

三、关键特性与优势

  • 小体积(SOD-323):适合便携与高密度 PCB 布局。
  • 低反向漏电:100nA 级别利于高阻抗节点和精密电压参考应用。
  • 合理稳压阻抗:30Ω 在中高电流范围提供较稳定的电压,200Ω 表示在微安级电流下膝区对调节能力有限,设计时应规避长期在该区工作。
  • 宽工作温度:适用于工业级温度环境。

四、典型应用场景

  • 小功率基准稳压:为模拟电路、传感器供参考电压或偏置电压。
  • 输入浪涌钳位/保护:保护后级器件免受瞬态过压(在有串联限流的情况下)。
  • 低功耗便携设备:电池检测、过压保护、参考源等。
  • 水平移位与接口保护:在数字信号线上作简单的电压钳位。

五、设计与热管理建议

  • 功耗限制:Pd=200mW 时,若二极管承受接近稳压电压的电压降,则最大稳态电流约为 200mW / 15V ≈ 13.3mA。推荐在设计中留出裕度,常用工作电流应低于此值(例如 ≤10mA)。
  • 串联电阻计算:R = (Vin - Vz) / Iz,Iz 应选定使二极管既工作在稳压区又不超过功耗。举例:若 Vin=30V,欲保证不超 Pd,R 最小为 (30-15)V /13.3mA ≈1.13kΩ,实际取值应更大并考虑瞬态情况。
  • 热路径与 PCB 布局:SOD-323 的热能力有限,建议增大焊盘铜面积、使用多层铜平面或加热散热孔以提高功耗承载;在高环境温度下需按热阻降额处理。
  • 工作点注意:避免长期在膝区(极低电流)或过高电流下运行,以免稳压不稳定或加速老化。

六、选型与测试提示

  • 验证条件:查看或测试稳压值与阻抗时,应注意标注的测试电流与温度;实际系统中建议在目标工作电流与温度下抽样验证。
  • 可靠性考虑:对温度循环、湿度与电应力敏感度高的应用,应评估封装抗焊接与热循环性能。
  • 替代与兼容:在更高功耗需求下,考虑更大耗散能力或更低阻抗的封装/型号。

本器件适合寻求小型化、低功耗稳压与保护方案的工程设计,按上述热、功率与工作点建议合理选型与布局,可获得稳定可靠的性能表现。

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