WMSIC Electronic Components

CJ CJ78D05

ModelCJ78D05
PackageTO-252-2(DPAK)
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ CJ78D05
Type
CJ
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
2V@(1A)
Electronic Component
CJ
Electronic Component
10uV
Electronic Component
CJ78D05
Electronic Component
1
Package
TO-252-2(DPAK)
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.449g
Electronic Component
1
Electronic Component
BM0228089312
Operating Temperature
25℃~+125℃@(Tj)
Operating Voltage
35V
Output
Electronic Component
Output Voltage
5V
Output Current
1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CJ78D05 固定 5V 线性稳压器(LDO)产品概述

一、主要规格概览

CJ78D05 为单路固定输出线性稳压器,主要参数如下:输出电压 5V;最大工作电压 35V;最大输出电流 1A;静态电流(Iq)约 3.5mA;压差(dropout)2V @ 1A;电源纹波抑制比 PSRR 68dB(120Hz);输出噪声约 10μV(典型值);工作结温范围 -25℃ ~ +125℃(Tj);封装为 TO-252-2 (DPAK)。输出为正极,单通道设计,适合需稳压5V且电流不超过1A的应用。

二、产品特点

  • 高输入电压能力:器件可承受最高 35V 输入,便于直接连接较高电压源或在较宽电压范围内工作。
  • 良好纹波抑制:120Hz 下 PSRR 达 68dB,能有效抑制电源及整流残余纹波,适合对噪声敏感的模拟/数字电路。
  • 低噪声输出:典型噪声 ~10μV,利于音频、ADC 和参考电路等对噪声要求高的系统。
  • TO-252-2 (DPAK) 封装:适合表面贴装并兼顾散热性能,便于自动化生产。

三、典型应用场景

  • 工业控制、嵌入式系统的 5V 供电轨。
  • 音频前端、传感器信号链、ADC 参考电源等对纹波和噪声敏感的电路。
  • 需要简单、低成本、可靠线性稳压的场合(低开关噪声优先于效率时)。

四、使用建议与注意事项

  • 最低输入电压:由于压差约 2V @1A,满载时输入电压应至少为 Vout + Vdrop ≈ 7V;轻载下压差可稍小,但仍建议保留裕量。
  • 散热与功耗计算:线性稳压器的耗散 Pd ≈ (Vin − Vout) × Iout。举例:Vin=12V、Iout=1A 时,Pd ≈ 7W;在 DPAK 封装下需采取适当散热(较大散热铜箔、散热片或外部热基板),否则结温会迅速升高。若输入电压远高于输出且负载电流较大,优先考虑开关预稳压或更换低压差/更高散热能力的方案。
  • 输入/输出电容:为确保稳定与瞬态响应,建议输入侧并联 0.1μF 陶瓷旁路 + 10μF(或更大)低ESR 电解/钽电容;输出侧至少配置 10μF 低ESR 电容并并联 0.1μF 陶瓷以抑制高频噪声。具体最小或最大电容与 ESR 要求请参照数据手册验证。
  • PCB 布局:输入、输出电容尽量靠近引脚并采用粗短轨迹;散热铜箔尽可能扩大到器件底部大焊盘并连通至多层地/电源平面以降低结温;将敏感模拟地与大电流回路区分并合理布局回流路径。

五、封装与引脚提示

  • 封装:TO-252-2 (DPAK),适合自动贴装与中等散热需求。
  • 引脚功能(通用说明):常见标识为 IN、GND(或 TAB 为散热地)、OUT。不同厂商具体引脚顺序与结线方式可能有差异,量产前务必参照 CJ 官方数据手册核对引脚定义与焊盘尺寸。

六、选型与可靠性建议

在选型阶段,应综合考虑输入电压范围、最大负载电流及散热条件。若系统输入电压长期远高于5V且负载接近1A,建议使用开关降压后接 LDO 做后端滤波以降低总体功耗并利用 LDO 的低噪特性。长期在高温或高功率耗散条件下工作时,需按热阻与结温极限进行可靠性评估并预留安全裕度。

如需器件详细电气特性曲线、引脚图和热阻数据,请提供或参考 CJ 的完整数据手册以获得精确设计参数。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.