WMSIC Electronic Components

CJ MPSA56

ModelMPSA56
PackageTO-92(TO-92-3)
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ MPSA56
Type
CJ
Minimum package
1000

Technical parameters

Electronic Component
CJ
Electronic Component
MPSA56
Electronic Component
1
Package
TO-92(TO-92-3)
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.213g
Electronic Component
1
Electronic Component
BM0264339308
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
50MHz
Power Dissipation(Pd)
625mW
Electronic Component
1000
Collector Current(Ic)
500mA
Current (h FE)
100

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MPSA56(PNP型双极型晶体管)产品概述

MPSA56是一款PNP型通用双极型晶体管(BJT),由国内知名半导体厂商江苏长电(CJ)生产,采用TO-92-3标准插件封装,适用于中低频小信号放大、低速开关及低压控制等场景。以下从核心特性、参数解析、应用场景等维度展开详细概述。

一、器件类型与基础定位

MPSA56属于通用PNP型BJT,区别于NPN型的电流流向(发射极电流流入基极),适合构建互补对称电路或特定极性驱动场景。其采用TO-92-3插件封装,引脚数量为3个,支持手工焊接与自动化插件,成本低、易获取,是电子设计中常用的基础器件之一。

二、关键电性能参数深度解析

MPSA56的参数针对小功率应用优化,核心参数如下:

1. 功率与电流容量

  • 耗散功率(Pd):625mW(结温下的最大允许功耗,连续工作时需注意散热,若用于脉冲场景可适当提升功率,但需控制占空比);
  • 集电极电流(Ic):500mA(连续工作的最大集电极电流,可覆盖多数小功率负载,如小型LED、继电器线圈);
  • 集射极饱和电压(VCE(sat)):250mV(测试条件:Ic=100mA、Ib=10mA时的饱和压降,低饱和压降可减少开关损耗,提升电路效率)。

2. 电压击穿与漏电流

  • 集射极击穿电压(Vceo):80V(基极开路时集电极与发射极间的最大击穿电压,为24V/48V等低压应用提供充足余量);
  • 射基极击穿电压(Vebo):4V(集电极开路时发射极与基极间的击穿电压,需避免反向偏置过压,防止器件损坏);
  • 集电极截止电流(Icbo):100nA(基极开路时集电极的反向漏电流,低漏电流可保证静态工作点稳定,减少热漂移对电路的影响)。

3. 增益与频率特性

  • 直流电流增益(hFE):100(测试条件:Vce=1V、Ic=100mA时的线性区增益,增益稳定,适合小信号放大);
  • 特征频率(fT):50MHz(截止频率,表征晶体管高频放大能力,属于中低频应用范围,不适合射频以上场景)。

三、适用典型应用场景

结合MPSA56的参数特性,其主要应用于以下场景:

1. 中低频小信号放大

如音频前置放大电路、传感器微弱信号调理(热电偶、光敏电阻信号放大),低漏电流(100nA)可有效抑制噪声,稳定放大微弱信号。

2. 低速开关电路

如500mA以内的LED驱动、小型继电器线圈驱动、简单电平转换电路,低饱和压降(250mV)可减少开关时的功率损耗。

3. 低压电源辅助控制

如24V/48V低压电源的反馈调节、过流保护电路,Vceo=80V的击穿余量可覆盖电源波动,提升电路可靠性。

4. 互补对称电路

与NPN型晶体管(如MPSA42)配合,构建互补对称放大电路(如音频功率放大前置级),实现正负信号的对称放大。

四、可靠性与环境适应性

MPSA56的可靠性满足多数工业及消费电子需求:

  • 工作温度范围:-55℃~+150℃(宽温范围,可适应户外低温、工业控制柜高温环境);
  • 参数稳定性:低漏电流、稳定hFE,减少温度变化对电路性能的影响;
  • 封装可靠性:TO-92-3塑料封装耐振动、抗冲击,适合批量插件工艺。

五、品牌与封装细节

  • 品牌:CJ(江苏长电/长晶),国内半导体龙头企业,产品通过ISO9001认证,质量稳定、供货充足;
  • 封装:TO-92-3(引脚布局:平面一侧朝向用户时,从左到右依次为发射极(E)、基极(B)、集电极(C)),方便手工焊接与电路设计。

总结

MPSA56作为性价比高的PNP型通用晶体管,凭借稳定电性能、宽温适应性及易使用的TO-92封装,广泛应用于中低频小信号放大、低速开关及低压控制场景,是电子工程师原型开发与批量生产的常用器件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.