Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ DTC124EE
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ DTC124EE
- Type
- CJ
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- DTC124EE
- Electronic Component
- 1
- Package
- SOT-523-3
- Electronic Component
- 1 NPN
- Electronic Component
- Digital Transistor
- Electronic Component
- 0.025g
- Electronic Component
- 1
- Electronic Component
- BM0228272144
- Operating Temperature
- 55℃~+150℃
- Resistor
- 1.2
- Resistor
- 28.6kΩ
- Transistor Type
- NPN
- Frequency(f T)
- 250MHz
- Power Dissipation(Pd)
- 150mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DTC124EE 数字晶体管（CJ）产品概述
一、产品简介
DTC124EE 是江苏长电（CJ）推出的一款 NPN 数字晶体管，内置基极限流/偏置网络，用于简化开关驱动电路和逻辑接口电平匹配。器件以 SOT-523-3 超小封装提供，适合空间受限的便携与消费电子产品。
二、主要电气参数
- 集电极—发射极击穿电压 Vceo：50 V
- 允许集电极电流 Ic：100 mA（峰值/短时）
- 最大耗散功率 Pd：150 mW（环境温度及散热条件需考虑降额）
- 直流电流增益 hFE：典型 56（条件：Ic=5 mA，Vce=5 V）
- 输入电阻：28.6 kΩ（内置）；电阻比率：1.2
- 输入/输出阈值与饱和：典型 VO(on)≈300 mV（在 10 mA 条件下）；VI(off) 最大 500 mV（测量条件 100 μA，Vcc=5V）
- 工作温度范围：-55 ℃ 至 +150 ℃
（注：实际开关阈值随工作点与温度变化，应参考器件曲线及典型应用条件调整）
三、核心特点与优势
- 内置基极限流电阻，直接与 MCU/逻辑门相连，无需外接基极电阻，减少器件数与 PCB 面积。
- 小型 SOT-523-3 封装，适合高密度贴片设计。
- 宽温度范围与较高的 Vceo（50 V），能承受更高工作电压或感性负载反向峰值。
- 较高的增益在小电流区段可保证良好饱和导通性能，输出低压降（VO(on) 典型 300 mV @10 mA）。
四、典型应用
- MCU/逻辑到小功率继电器、蜂鸣器或 LED 的直接驱动。
- 电平移位与信号整形（内置电阻便于直接接口）。
- 便携设备、家电控制板、传感器模块等对体积和成本敏感的场合。
五、设计与使用建议
- 虽然 Ic 额定 100 mA，长期工作时应受限于 Pd（150 mW），建议在实际电流和 VCE 条件下计算耗散并做热降额。
- 对感性负载建议在集电极端并联反向续流二极管以吸收反向尖峰，保护晶体管。
- 输入端直接连接 MCU 时，注意 MCU 输出电平与 VI(on)/VI(off) 特性匹配，避免输入悬浮或亚阈值驱动导致不稳定开关。
- 小封装热阻较大，应保持集电极引脚与 PCB 散热铜箔良好接触，必要时增加散热面积。
六、封装与可靠性注意事项
- SOT-523-3 为超小封装，焊接时注意回流温度和时间，避免过热损伤。
- 工作环境温度范围宽，但在高温下器件可靠性与功耗能力下降，应做降额设计。
- 生产选型时可参考长电提供的完整器件数据表以获取完整的极限参数和特性曲线。
总结：DTC124EE 适合需要小体积、低成本、能直接由逻辑电平驱动的小功率开关场合。合理评估功耗与热管理、并针对负载类型做防护电路，可获得稳定可靠的使用效果。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
