WMSIC Electronic Components

CJ CJ74LVC07BDN

ModelCJ74LVC07BDN
PackageTSSOP-14
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ CJ74LVC07BDN
Type
CJ
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
CJ74LVC07BDN
Electronic Component
1
Package
TSSOP-14
Electronic Component
Buffers / Drivers / Transceivers
Electronic Component
74LVC
Electronic Component
0.24g
Electronic Component
1
Electronic Component
1
Features
Level Conversion
Electronic Component
BM0265022276
Operating Temperature
40℃~+125℃
Operating Voltage
1.2V~5.5V
Type
TTL CMOS
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CJ74LVC07BDN 产品概述

一、产品简介

CJ74LVC07BDN 是江苏长电(CJ/长晶)推出的一款六位门缓冲/驱动器,属于 74LVC 系列,采用 TSSOP-14 封装。器件为单向输入、开漏(open-drain)输出结构,输入为 TTL 兼容的 CMOS 级,适用于低压高速逻辑与不同电平域之间的电平转换与总线驱动场合。工作电压范围宽:1.2V 至 5.5V,工作温度覆盖工业级 -40℃ 至 +125℃。

二、主要特性

  • 供电电压:1.2 V 至 5.5 V,便于多电压系统集成
  • 通道数:1 片器件包含 6 位独立通道(单向)
  • 输出类型:开漏输出,需外接上拉电阻,实现高电平输出
  • 汲电流能力:IOL 可达 32 mA,适合驱动较大负载或作为总线下拉驱动器
  • 静态电流:Iq 典型值 10 μA,静态功耗低,适合低功耗系统
  • 传播延迟:tpd = 1.6 ns(在 VCC=5V、CL=50 pF 时),具备高速响应能力
  • 工作温度范围:-40℃ 至 +125℃,满足工业级环境要求

三、电气性能亮点

器件在 5.0 V 供电、50 pF 负载条件下的传播延迟仅 1.6 ns,适合高速数据总线和接口场合。开漏结构允许多个输出线并联实现有线与(wired-AND)或与外部上拉配合进行电平移位。32 mA 的下拉能力使其在驱动指示灯、继电器前端或较大输入电容负载时仍保持可靠的低电平拉低性能。静态电流低于 10 μA,有利于待机节能设计。

四、典型应用

  • 电平转换:在不同芯片电压域之间,通过外部上拉实现安全的电平移位
  • 总线驱动与仲裁:作为开漏总线(如某些串行或并行总线)下拉驱动器或仲裁逻辑
  • MCU/FPGA I/O 扩展:保护上拉到目标总线电压以适配外设接口
  • 驱动小型负载:指示灯、继电器驱动前级等(注意功耗与热设计)

五、使用建议与注意事项

  • 开漏输出需外接上拉电阻,上拉电压应在器件允许范围内(不超过器件最大额定电压);上拉阻值按总线电容与上升时间要求选择(常见取值 4.7 kΩ 至 100 kΩ,具体按速率调整)。
  • 未使用的输入引脚应避免悬空,建议拉到定义电平以防止功耗增加或不确定切换。
  • 电源旁路电容(如 0.1 μF)应靠近 VCC 引脚布置,以保证高速切换稳定性并抑制瞬态干扰。
  • 由于器件为开漏结构,高电平由外部上拉提供,器件自身不能主动拉高输出,系统设计时需确认上拉能力与速率匹配。
  • 在高 IOL 工作点下注意器件功耗与封装热阻,必要时评估散热需求。

六、封装与订购信息

  • 品牌:江苏长电(CJ/长晶)
  • 型号:CJ74LVC07BDN
  • 封装:TSSOP-14
  • 单位:每件器件含 6 位通道,适合批量采购与板级集成

总结:CJ74LVC07BDN 将低压宽电源兼容、高速响应与开漏灵活性结合,适用于需要电平转换、开漏总线驱动或多电压系统接口的工业与消费类电子设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.