WMSIC Electronic Components

CJ MMBD4448HTW

ModelMMBD4448HTW
PackageSOT-363
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ MMBD4448HTW
Type
CJ
Minimum package
3000

Technical parameters

Electronic Component
CJ
Electronic Component
MMBD4448HTW
Electronic Component
1
Package
SOT-363
Electronic Component
Switch Diode
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0230031843
Current
250mA
Diode
3
Current(Ir)
100nA@70V
(Vf)
1.25V@150mA
Power Dissipation(Pd)
200mW
Electronic Component
3000
Voltage Rating(Vr)
80V
(Trr)
4ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBD4448HTW 产品概述

一、器件简介

MMBD4448HTW 是 CJ(江苏长电/长晶)生产的三只独立开关二极管,封装为 SOT-363(SC-88)小型贴片封装。器件针对高速开关和小信号整流场景设计,体积小、切换快,适合空间受限的便携和通信类电路。

二、主要电气参数(典型/额定)

  • 正向压降 Vf = 1.25 V @ If = 150 mA
  • 直流反向耐压 Vr = 80 V
  • 正常整流电流(平均)If(AV) = 250 mA
  • 峰值非重复浪涌电流 Ifsm = 2 A(脉冲)
  • 功耗耗散 Pd = 200 mW
  • 反向电流 Ir = 100 nA @ 70 V
  • 反向恢复时间 Trr = 4 ns

这些参数表明该器件在高压(最高 80 V)、高速切换与中小电流场合具有良好性能。

三、性能要点与设计注意

  • 热耗散与电流限制:额定耗散 Pd=200 mW 与 Vf=1.25 V 联合决定了连续导通时的安全电流(近似 Pd/Vf ≈ 160 mA)。尽管If(AV)标称250 mA,250 mA通常为短时整流能力或受PCB散热条件限制的额定值,布局时建议功率降额以保证可靠性。
  • 开关特性:Trr=4 ns 属于快速恢复等级,适合高速开关、脉冲整形、逻辑接口等场景,但在高频大电流开关中仍需考虑恢复损耗与电磁干扰。
  • 反向特性:Vr=80 V 和 Ir 在 70 V 时仅 100 nA,适合需要较高反向耐压、低漏电的保护/钳位用途。
  • 冲击能力:Ifsm=2 A 表示短脉冲浪涌能力,可处理瞬态电流,但不可用于频繁大电流循环。

四、典型应用

  • 开关电路与高速整流(脉冲整流、时钟/数据恢复)
  • 输入/输出保护与反向极性保护(需配合其他元件考虑电压和功耗)
  • 电平移位、钳位电路、浪涌吸收与钳位二极管阵列
  • 通信设备、便携式电子、工业控制中空间受限的保护与整形电路

五、封装与封装注意事项

SOT-363(SC-88)体积小、适合高密度贴片。焊接采用回流工艺,推荐按照制造商的回流曲线和 PCB 焊盘设计规范。因器件热阻较大,需通过合适的铜皮面积、散热铜箔和多层板设计改善散热。并联使用时需注意正向压降匹配问题,不建议直接并联无均流措施。

六、选型建议与可靠性

选型时结合实际工作电流、占空比与散热条件,若连续电流接近或超过 Pd/Vf 建议换用更大功耗或更低 Vf 的器件。用于关键系统或高温环境时应做降额设计与可靠性验证。总体而言,MMBD4448HTW 以其高耐压、低漏电与快速恢复特性,适合需要节省PCB面积且有中等电流与高速切换需求的场合。

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