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FOJAN FRC0402F8661TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F8661TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F8661TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 8.66kΩ
- Electronic Component
- 10
- Electronic Component
- BM0264900160
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F8661TS 产品概述
一、产品简介
FRC0402F8661TS 是 FOJAN（富捷）出品的一款贴片厚膜电阻，封装尺寸为 0402（公制 1005），标称阻值 8.66 kΩ，电阻精度为 ±1%。该器件为超小型、低功耗的通用贴片电阻，适合用于对体积和精度有一定要求的消费电子、通信设备及移动终端电路中作为分压、偏置和信号限流元件。
二、主要性能参数
- 电阻类型：厚膜电阻
- 阻值：8.66 kΩ
- 精度：±1%（1% 级）
- 额定功率：62.5 mW（1/16W 等效）
- 最大工作电压：50 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55 ℃ 至 +155 ℃
- 封装：0402（1005 英制）
- 品牌：FOJAN（富捷）
三、特点与优势
- 小尺寸：0402 封装占板面积小，便于高密度贴装，适合微型化设计。
- 精度较高：±1% 精度满足多数模拟/数字电路对阻值稳定性的需求。
- 宽温区：-55 ℃ 至 +155 ℃ 的工作温度范围适应工业级温度需求。
- 稳定性：厚膜工艺结合 ±100 ppm/℃ 的温度系数，在温度变化环境中保持良好阻值稳定性。
- 兼容常规贴装工艺：适用于回流焊等 SMT 贴装流程，便于工业化生产。
四、典型应用场景
- 移动终端与可穿戴设备（限板面积与低功耗场合）
- 精密分压、基准电路与输入阻抗匹配
- 传感器前端、模拟信号处理与滤波网络
- 通信设备与消费电子的电路偏置与限流
- 工业控制与测试设备（在额定环境范围内）
五、封装与可靠性
0402 小尺寸带来布局灵活性的同时对焊接与取放要求较高。FOJAN 的厚膜电阻在出厂测试中通常经过阻值、耐温、耐湿及机械应力的检验，能满足常见的可靠性标准。为保证长期可靠性，建议遵循制造商的储存与回流焊规范，避免超出推荐的温度曲线与长期高温高功率工作状态。
六、选型与使用建议
- 功率余量：实际设计中建议留有功率裕度，不建议长期在额定 62.5 mW 边界运行。对发热敏感的场合应考虑更大功率或更大封装尺寸。
- 电压与电流限制：单片最大工作电压 50 V，设计时应保证电压和电流不会超出器件允许值。
- 温度影响：±100 ppm/℃ 的 TCR 在温度剧烈变化时会影响阻值精度，必要时可考虑更低 TCR 的精密电阻件。
- 贴装注意：采用适配的回流焊曲线和吸放料工艺，避免过度机械应力造成裂纹或接触不良。
- 备件与替代：在需要更高功率或更低温漂时，可考虑换用 0603 或更大封装的厚膜/薄膜电阻或金属膜精密电阻。
如需样品规格书、回流焊建议或批量报价，可提供更详细的应用条件和环境参数，便于推荐最合适的订购方案。
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