WMSIC Electronic Components

FOJAN FRC0402F1301TS

ModelFRC0402F1301TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1301TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1301TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
1.3kΩ
Electronic Component
10
Electronic Component
BM0265123832
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0202F1301TS 厚膜贴片电阻产品概述

一、产品定位与核心身份

FRC0202F1301TS是富捷电子(FOJAN)推出的一款0402封装厚膜贴片电阻,针对高密度、小体积电子设备中的低功率信号电路设计,兼具高精度、宽温区与高可靠性,属于工业级通用型贴片电阻范畴,可覆盖消费电子、工业控制、通信等多领域应用需求。

二、关键性能参数详解

该电阻的核心参数围绕“小体积、高精度、宽温适应”设计,具体如下:

  • 阻值与精度:标称阻值1.3kΩ(代码1301),精度±1%——在1.3kΩ基础上偏差不超过13Ω,可满足模拟信号调理、传感器接口等对阻值一致性要求较高的场景;
  • 功率与电压:额定功率62.5mW,最大工作电压50V——适配小电流(约6.25mA@50V)电路,避免因功率过载导致的电阻失效;
  • 温度特性:温度系数±100ppm/℃,工作温度范围-55℃~+155℃——温漂适中,可在极端温度环境下保持阻值稳定,覆盖工业级设备的温区要求;
  • 封装规格:0402英制封装(尺寸约1.0mm×0.5mm),符合IPC标准,适配高密度PCB布局。

三、封装与工艺优势

  1. 小体积高密度:0402封装是当前贴片电阻中体积较小的规格之一,可显著减少PCB占用面积,适合智能手机、智能穿戴、物联网模块等对空间要求苛刻的产品;
  2. 厚膜工艺特性:采用厚膜印刷工艺制造,相比薄膜电阻成本更低,且具有更好的抗机械应力(如焊接冲击、振动)与抗潮湿能力,适合批量生产与复杂应用环境;
  3. 批次一致性:富捷电子的生产工艺可保证同批次电阻的阻值、温漂等参数一致性,降低终端产品的调试难度。

四、典型应用场景

该电阻的参数特性使其适用于以下场景:

  • 消费电子:智能手机、平板的音频电路、电源管理模块的小信号分压;
  • 工业控制:传感器信号调理电路(如温度、压力传感器的信号放大)、小型PLC的输入输出接口;
  • 通信设备:射频前端的偏置电路、光模块的信号匹配网络;
  • 物联网设备:低功耗传感器节点的信号滤波、电源分压;
  • 汽车电子:部分非高温极端的辅助电路(如仪表盘指示灯驱动、车身控制模块的小信号电路)。

五、可靠性与环境适应性

  1. 宽温稳定:-55℃~+155℃的工作温区覆盖了工业级设备的典型环境(如户外控制柜、车载电子的部分区域),可在高低温循环下保持性能稳定;
  2. 抗环境干扰:厚膜工艺可抵抗湿度、盐雾等环境因素的影响,符合相关可靠性测试标准(如GB/T 2693-2001电子元器件的环境试验);
  3. 焊接可靠性:端电极采用镀锡工艺,适配回流焊、波峰焊等主流焊接方式,焊接后无虚焊、脱落等问题。

六、品牌与品质保障

富捷电子(FOJAN)是国内专注被动元件研发与生产的厂商,拥有多年贴片电阻制造经验,产品覆盖全系列封装与阻值。FRC0202F1301TS通过了RoHS、REACH等环保认证,出厂前经过100%阻值测试与温漂抽检,可满足客户对品质一致性与可靠性的要求。

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