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FOJAN FRC0402F1333TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F1333TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F1333TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 133kΩ
- Electronic Component
- 10
- Electronic Component
- BM0264525403
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F1333TS 产品概述
一、产品简介
FRC0402F1333TS 是 FOJAN（富捷）推出的一款高密度贴片厚膜电阻，封装为 0402（约 1.0 × 0.5 mm），阻值为 133 kΩ，精度为 ±1%。该器件面向空间受限且对精度有一定要求的现代电子产品，兼顾尺寸小、性能稳定与成本优势，适合自动化贴装与回流焊装配。
二、主要性能参数
- 阻值：133 kΩ
- 精度：±1%
- 功率额定：62.5 mW（室温）
- 允许工作电压：50 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55 ℃ 至 +155 ℃
- 封装：0402（0603 以下的超小封装）
- 类型：厚膜电阻
三、主要特点
- 超小封装，适合高密度 PCB 设计与便携设备用途。
- ±1% 精度保证中等精度电路的稳定性。
- 良好的温度稳定性，TCR ±100 ppm/℃，适合对温漂有要求的应用。
- 中低功率消耗（62.5 mW），适配信号链与偏置网络等低功率场景。
- 兼容常规 SMT 工艺，便于量产贴装与回流焊接。
四、典型应用场景
- 移动通信、蓝牙/射频前端中的偏置与分压网络。
- 精密模拟电路的参考网络与阻抗匹配元件。
- 消费电子、可穿戴设备以及物联网终端中对尺寸和稳定性有要求的电路。
- 工业控制与测量仪器中非高功率阻值需求的场合。
五、使用与注意事项
- 建议在额定功率范围内使用，环境温度升高时应按厂商降额曲线处理以避免过热。
- 适用于常规无铅回流焊工艺，建议遵循器件供应方的焊接温度曲线与PCB热管理设计。
- 0402 封装体积小，贴装时需使用合适的取放头与回流参数，避免机械应力或过度热冲击。
- 在高湿、腐蚀性气氛或强振动环境下，请评估封装与工艺对长期可靠性的影响并配合防护措施。
六、包装与质量保障
FRC0402F1333TS 适用于标准 SMT 卷带包装，方便自动化生产线直接贴装。FOJAN 品牌提供过程控制与检验流程，出厂前对阻值、精度及外观进行检测，满足电子装配的一般可靠性要求。购买时建议向供应商确认批次、合格证及可追溯的质量文件。
如需样品、详细规格书（含降额曲线、焊接建议与可靠性试验数据）或大宗采购信息，请联系 FOJAN 授权经销商或技术支持。
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