WMSIC Electronic Components

FOJAN FRC0402F9091TS

ModelFRC0402F9091TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F9091TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F9091TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
9.09kΩ
Electronic Component
10
Electronic Component
BM0264900119
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F9091TS 产品概述

一、产品简介

FRC0402F9091TS 为 FOJAN(富捷)系列贴片厚膜电阻,封装规格为 0402(公制 1005)。标称阻值 9.09 kΩ,精度 ±1%,额定功率 62.5 mW,最大工作电压 50 V。产品温度系数为 ±100 ppm/℃,工作温度范围 -55℃ 至 +155℃,适用于体积受限且对精度与温度稳定性有中等要求的电子设备。

二、主要参数

  • 阻值:9.09 kΩ
  • 精度:±1%
  • 功率:62.5 mW(0402 封装,额定值)
  • 工作电压:50 V(最大额定电压)
  • 温度系数:±100 ppm/℃(典型厚膜等级)
  • 工作温度:-55℃ ~ +155℃
  • 封装:0402(1005)
  • 类型:厚膜贴片电阻
  • 品牌:FOJAN(富捷)

三、性能特点

  • 封装小巧,适合高密度 PCB 设计与便携式产品。
  • ±1% 精度满足常见精密分压、滤波和偏置网络需求。
  • ±100 ppm/℃ 的温度系数在多数消费电子与工业应用中提供可接受的温度稳定性。
  • 厚膜工艺成本优势明显,产能和品种覆盖广泛,交付便捷。
  • 工作温度范围宽,适应严苛环境与温度循环。

四、应用场景

  • 移动终端与可穿戴设备:体积受限且对可靠性有要求的电阻网络。
  • 工业控制与传感前端:信号处理、分压、电平匹配场合。
  • 通信与物联网设备:滤波、偏置、参考电路。
  • 消费电子与家电:电路板上通用阻值需求的替代项。

五、使用与选型建议

  • 由于 0402 封装功耗受限,实际使用中建议按环境和散热条件对额定功率做适当降额(常见 50% 或按 PCB 热阻计算)。
  • 工作电压不得超过 50 V,遇高压或瞬态场合应采用更高电压等级或串联电阻方案。
  • 若对噪声、长期稳定性或温漂有更高要求,建议对比金属膜或薄膜电阻产品。
  • PCB 布局时注意焊盘尺寸与热流设计,避免热应力集中影响可靠性。

六、可靠性与焊接

  • 适合回流焊工艺,建议遵守焊膏与回流曲线的标准温度规程;高温/长时间加热可能影响电阻性能。
  • 小尺寸器件易受机械与热冲击,贴装与清洗过程需注意防裂与防潮处理。
  • 出货和储存建议按元件厂商提供的包装与防潮等级要求执行,以保证焊接可靠性与长期稳定性。

如需更详细的环境试验数据、封装尺寸图或回流曲线,请提供型号或咨询 FOJAN(富捷)官方技术资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.