WMSIC Electronic Components

FOJAN FRC1206F20R0TS

ModelFRC1206F20R0TS
Package1206
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC1206F20R0TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC1206F20R0TS
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
20Ω
Electronic Component
1
Electronic Component
BM0261485680
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC1206F20R0TS 产品概述

一、产品简介

FRC1206F20R0TS 是 FOJAN(富捷)出品的一款 1206 封装厚膜贴片电阻,标称阻值 20Ω,额定功率 250mW,精度 ±1%。该型号针对常规电子设备中对中低阻值、高稳定性和中等功率散热要求的设计,兼顾制造成本与可靠性,适合大批量 SMT 生产。

二、主要性能参数

  • 阻值:20Ω
  • 精度:±1%(1/100)
  • 额定功率:250mW
  • 最高工作电压:200V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:1206(典型尺寸约 3.2mm × 1.6mm)
  • 结构类型:厚膜电阻

三、产品特点

  • 精度高、稳定性好:±1% 精度满足常见分压、限流及阻抗匹配需求;±100 ppm/℃ 的温漂保证在宽温区间内阻值变化可控。
  • 中等功率承载:250mW 额定功率适用于小尺寸电路板的热管理要求,适合功率分配合理的设计场合。
  • 抗环境能力强:工作温度范围达 -55℃~+155℃,可用于工业级及车规附近温度场景(需按项目可靠性验证)。
  • 兼容 SMT 工艺:适合回流焊工艺与自动贴装,利于大规模生产。

四、典型性能与热降额建议

  • 在环境温度升高时应按器件制造商或系统设计要求进行功率降额。一般建议以室温(25℃)至最高工作温度范围线性降额,在 155℃ 附近接近或降至额定功率以下。
  • 由于 1206 尺寸有限,散热主要依赖于 PCB 铜箔和焊盘设计,建议在高功率场合增大焊盘铜面积或采用散热层以降低焊点热阻。

五、应用场景

  • 功率分流与限流:用于中低电流路径的限流或分流电阻。
  • 信号处理与阻抗匹配:适用于模拟电路、滤波或阻抗匹配场合。
  • 电子仪表与工业控制:在工作温度和稳定性要求较高的工业设备中有良好表现。
  • 通信与消费电子:用于板级电路中的标准电阻应用。

六、使用与焊接注意事项

  • 推荐采用标准无铅回流焊工艺,遵循回流曲线规范,峰值温度不超过器件和焊料规范允许值(通常 ≤ 260℃)。
  • 焊盘设计应考虑热传导,必要时增大焊盘面积和铜厚以提高散热能力。
  • 储存与贴装时注意防潮、防污染,避免在超出推荐温湿度下长期存放,以免影响焊接可靠性和电气性能。
  • 实际应用中若环境或封装限制导致器件工作温度长期偏高,建议进行热仿真验证或选用更高功率等级的电阻元件。

七、质量与检验

FOJAN(富捷)提供的厚膜电阻通过常规的电气性能检验与可靠性测试(如焊接耐热、冷热循环、潮湿负荷等),适用于量产和工程验证。为确保系统可靠性,建议在设计阶段配合样品做温升、寿命与环境可靠性测试。

附注:以上信息基于规格参数与常见工程经验,具体应用请参考厂方数据手册与样品实测结果。若需 CAD 尺寸图、回流曲线或可靠性报告,可向供应商索取 FRC1206F20R0TS 的详细技术资料。

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