WMSIC Electronic Components

FOJAN FRC0402F1623TS

ModelFRC0402F1623TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1623TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1623TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
162kΩ
Electronic Component
10
Electronic Component
BM0265307096
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F1623TS 厚膜贴片电阻产品概述

FRC0402F1623TS是FOJAN(富捷)针对高密度电子电路设计推出的0402封装厚膜贴片电阻,核心定位为低功耗、高精度场景下的电阻匹配元件,具备宽温稳定性、小型化集成等优势,适配消费电子、工业控制等多领域应用需求。

一、核心参数与规格明细

该电阻的关键技术参数经过标准化设计,可覆盖多数常规电路的性能要求:

  • 阻值与精度:标称阻值162kΩ(贴片代码“1623”,即162×10³Ω),精度公差±1%,满足信号调理、电压分压等场景的精准匹配需求;
  • 功率与电压:额定功率62.5mW,最大工作电压50V,适配低功耗电路的功率预算设计;
  • 温度特性:温度系数±100ppm/℃,工作温度范围-55℃~+155℃,极端温度下阻值漂移可控,适合工业级应用;
  • 封装形式:0402英寸贴片封装(尺寸约1.0mm×0.5mm),符合小型化电路的空间设计要求。

二、封装与工艺特点

  1. 小型化封装设计
    0402封装为主流小型贴片封装之一,尺寸仅1.0mm(长)×0.5mm(宽),可显著节省PCB布局空间,适配智能手机、智能穿戴等高密度集成产品;焊盘设计兼容回流焊、激光焊等主流焊接工艺,生产兼容性强。

  2. 厚膜工艺优势
    采用厚膜电阻工艺(丝网印刷+高温烧结),相比薄膜电阻成本更低,且耐湿性、机械稳定性良好;电阻膜层与陶瓷基底结合牢固,长期使用中阻值漂移风险低。

三、典型应用场景

结合参数特性,FRC0402F1623TS适用于以下场景:

  • 消费电子:智能手机、平板电脑的音频信号调理电路、电源分压回路(小封装适配终端设备小型化需求);
  • 工业控制:小型传感器模块(温度、压力传感器)的信号放大电路、PLC输入输出接口的限流电阻(宽温范围覆盖工业现场高低温环境);
  • 通信设备:小型基站、路由器的射频前端匹配电路、电源滤波支路(±1%精度满足信号传输阻抗匹配要求);
  • 汽车电子:车载辅助系统(倒车雷达、胎压监测)的低功耗控制电路(工作温度覆盖车载环境波动)。

四、性能优势总结

  1. 精准稳定:±1%精度与±100ppm/℃温度系数,宽温范围内阻值偏差小,保证电路信号一致性;
  2. 小型集成:0402封装节省PCB空间,适配高密度电路设计,降低终端产品体积与重量;
  3. 宽温可靠:-55℃~+155℃工作范围,满足工业级、车载级极端环境使用要求;
  4. 性价比高:厚膜工艺结合批量生产能力,在保证性能的前提下降低采购成本,适合大规模应用。

五、品牌与质量保障

FOJAN(富捷)作为国内电子元器件专业厂商,FRC0402F1623TS具备以下质量保障:

  • 符合RoHS 2.0环保标准,无铅无镉,适配绿色电子产品设计;
  • 生产过程通过ISO 9001质量管理体系认证,每批次经阻值测试、功率老化、温漂检测等多重工序;
  • 产品一致性好,满足批量生产参数匹配需求,降低终端产品调试成本。

该电阻凭借精准、稳定、小型化特性,成为低功耗电路设计中厚膜贴片电阻的优选方案,有效支撑多领域电子设备的性能实现。

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