WMSIC Electronic Components

FOSAN S8550

ModelS8550
PackageSOT-23
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN S8550
Type
FOSAN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
S8550
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0228561506
Transistor Type
PNP
Frequency(f T)
120MHz
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
500mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S8550 产品概述

一、主要特性

S8550(FOSAN 富信,SOT-23 封装)是一款通用小功率三极管,适用于小信号放大与开关负载。器件关键特性如下:

  • 集电极电流 Ic:500 mA(最大)
  • 集-射极击穿电压 Vceo:25 V
  • 最大耗散功率 Pd:225 mW(封装热限,Ta=25°C 典型值)
  • 直流电流增益 hFE:400(条件:Ic=100 mA,Vce=1 V,典型值)
  • 特征频率 fT:120 MHz(典型)
  • 集电极截止电流 Icbo:100 nA(常温)
  • 集电极饱和电压 VCE(sat):≤600 mV(条件:Ic=500 mA,Ib=50 mA)
  • 发射—基极击穿电压 Vebo:5 V

二、电气参数概览

S8550 在中等电流和中频范围内表现良好。高 hFE 值使其在放大器级中能以较小基极驱动获得较大集电极电流;fT=120 MHz 允许在 VHF 较低端的信号处理。需要注意的是,SOT-23 的耗散功率受限(225 mW),在高电流工作时必须关注结温和热耗散,避免长时间满载工作。

三、典型应用场景

  • 低功率功率放大与前置放大器(小信号放大)
  • 低压电源开关与驱动(继电器/LED 驱动的低频场合)
  • 信号整形、缓冲与电平转换
  • 移动设备、家电与消费类电子的通用放大单元

四、封装与热管理

S8550 常见为 SOT-23 小外形封装,适合高密度 PCB 布局。SOT-23 的热阻较大,Pd=225 mW 为器件在环境温度 25°C 下的功率极限,建议设计时:

  • 在高 Ic 工作条件下采用短脉冲驱动或降低占空比;
  • 增加 PCB 散热铜箔面积,使用散热过孔;
  • 按厂表给出功率随环境温度的降额曲线进行设计。

五、选型与使用建议

  • 若工作电流长期接近数百毫安,优先评估热耗散并考虑更大封装器件(如SOT-223或TO-220);
  • 基极反向电压不可超过 Vebo=5 V,防止基-发结损坏;
  • 饱和开关时需提供足够基极电流(例如 Ib≈Ic/10)以降低 VCE(sat);
  • 检查实际器件 Datasheet 的引脚顺序与最大额定值(不同厂商封装管脚可能差异)。

六、典型电路示例与注意事项

  • 放大器:在共射放大配置中,利用高 hFE 可减小偏置电阻,提高输入阻抗;但需注意早期效应与温漂;
  • 开关:当作为低压开关驱动负载时,设计基极限流并计算饱和基流以确保 VCE(sat) 在可接受范围内;
  • 测试与可靠性:建议在样机阶段验证温升、长期漂移和反向泄漏随温度变化情况。

常见封装引脚排列(仅供参考,不同厂商可能不同,请以厂商 Datasheet 为准):SOT-23 引脚 1:基极(B),2:发射极(E),3:集电极(C)。总体而言,S8550 在小体积与中等电流场合提供良好的增益与频率特性,适合通用小信号放大与低压开关应用。

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