Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOSAN BZT52C5V6
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN BZT52C5V6
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- BZT52C5V6
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- (Zzk)
- 400Ω
- (Zzt)
- 40Ω
- Electronic Component
- BM0264886301
- Diode
- 1
- Current(Ir)
- 1uA
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 5.2V~6V
- Electronic Component
- 65℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C5V6 产品概述（FOSAN 富信）
一、产品简介
BZT52C5V6 是一款独立式稳压二极管，标称稳压值为 5.6V，由 FOSAN（富信）提供，通常以 SOD-123 表面贴装封装交付。该器件用于小功率稳压、基准和瞬态抑制等场景，凭借体积小、响应快的特点，适合便携和密集布局的电路板设计。
二、主要电气参数
- 标称稳压值（VZ）：5.6V（规格范围 5.2V～6.0V）。
- 最大耗散功率（Pd）：500mW，适用于低功率稳压和钳位。
- 反向电流（IR）：典型 1µA（在规定反向电压下的小信号漏电）。
- 阻抗：Zzt = 40Ω，Zzk = 400Ω（分别反映不同测试条件下的动态阻抗特性）。
- 工作结温范围：-65℃ ～ +150℃，具备宽温度适应能力，适合工业级应用。
注：上述参数为器件关键指标，具体测试条件与极限值请以厂商数据手册为准。
三、封装与机械特性
SOD-123 小型贴片封装占板面积小，厚度低，适合自动回流焊工艺。封装有利于高密度布板和批量生产，但由于功耗限制，热阻和布板散热设计需要重点考虑。焊盘布局应遵循厂商推荐的封装尺寸和焊接规范，以保证焊点可靠性和热传导效率。
四、热性能与可靠性建议
尽管器件额定耗散为 500mW，但实际允许功率受铜箔面积、PCB 散热能力与环境温度影响显著。设计时应：
- 在高环境温度或连续功耗场景下进行温度降额处理；
- 在 PCB 上为器件提供足够的散热铜箔或热 vias，以降低结温；
- 避免长时间在接近最大耗散功率的工况下运行，以延长寿命并降低漂移风险。
此外，遵循回流焊温度曲线和抗热循环测试规范可提高封装可靠性。
五、典型应用场景
- 小功率基准电压源与局部稳压（如传感器供电、参考电路）；
- 信号线/电源线的浪涌钳位与过压保护；
- 电池供电设备的简单电压钳制与保护；
- 混合信号设备中用于保护微控制器和模拟前端的瞬态抑制。
该器件适合对精度要求不是极高但要求体积小、成本低、响应迅速的应用。
六、选型与使用建议
- 如需更低动态阻抗或更高稳定度，应考虑更大功耗的封装或精密基准源；
- 在高脉冲电流或频繁浪涌场合，优先评估能量吸收能力和热冲击耐受性；
- 设计时请参照 FOSAN 的完整数据手册获取测试条件（如测量电流、温度点）及绝对最大额定值；
- 样片评估阶段进行温升、长期漂移及温度循环测试，以验证在目标应用环境中的可靠性。
总结：BZT52C5V6（FOSAN，SOD-123）是一款适用于低功耗稳压、钳位与保护的通用稳压二极管，具有 5.6V 标称电压、500mW 功耗能力和宽工作温度范围，适合空间受限且功率要求适中的电子设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
