WMSIC Electronic Components

HRE CGA0201X5R104K350ET

ModelCGA0201X5R104K350ET
Package0201
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0201X5R104K350ET
Type
HRE
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0201X5R104K350ET
Electronic Component
1
Electronic Component
100nF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0265744157
Electronic Component
X5R
Voltage
35V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0201X5R104K350ET多层陶瓷电容产品概述

CGA0201X5R104K350ET是HRE芯声推出的一款小型化多层陶瓷电容(MLCC),针对高密度贴装、温度稳定性需求设计,广泛适配消费电子、工业控制等领域的小型化设备。以下从核心属性、性能参数、应用场景等维度展开概述。

一、产品定位与基本属性

该型号属于常规中容值MLCC,核心定位为高集成度、温度稳定型被动元件,满足电路中滤波、耦合、去耦等基础功能需求。其关键属性可概括为:

  • 封装:0201(英制,对应公制0603,体积紧凑);
  • 容值精度:±10%(覆盖大多数常规电路设计余量);
  • 电压等级:35V直流(高于16V/25V常规等级,适配更多电压场景);
  • 温度特性:X5R(平衡容值稳定性与成本的主流温度系数)。

二、关键性能参数深度解析

2.1 容值与精度

容值标称100nF(标识“104”,即10×10⁴pF),精度±10%,在-55℃~+85℃范围内容值变化控制在±15%以内。此参数既满足电源滤波、信号耦合的基础容值需求,又避免了过高精度带来的成本冗余,适合批量应用。

2.2 额定电压

35V直流额定电压(标识“350”,即35V),高于常见的16V、25V等级,可覆盖:

  • 消费电子中5V/12V电源的二次滤波;
  • 工业设备中24V控制电路的去耦;
  • 避免因电压波动(如瞬态过压)导致的击穿风险。

2.3 温度系数

采用X5R陶瓷介质,温度范围为**-55℃~+85℃**,容值变化率≤±15%。相比Y5V(±20%以上)稳定性更强,适合温度变化较明显的户外设备、工业现场,同时比NP0(零温度系数)成本更低,是性价比最优的选择之一。

2.4 封装与标识

  • 封装:0201,尺寸约为0.6mm(长)×0.3mm(宽)×0.3mm(厚),体积仅为0805封装的1/4左右,可大幅提升PCB集成度;
  • 标识:型号中“CGA”为MLCC通用前缀,“0201”为封装,“X5R”为温度系数,“104K”中“K”代表±10%精度,“350”为35V电压,“ET”为生产批次/工艺代码。

三、封装与结构设计优势

3.1 多层叠层工艺

内部采用陶瓷介质层+镍电极层交替叠合(通常为数十层),既保证容值稳定,又降低了寄生电阻(ESR)和寄生电感(ESL)——ESR约为几十毫欧,ESL约为几纳亨,适合高频电路(如射频模块)的信号滤波。

3.2 端电极设计

采用三层端电极结构(银层→镍层→锡层):

  • 银层:提升电极导电性,减少接触电阻;
  • 镍层:抗硫化,避免长期暴露在含硫环境中氧化;
  • 锡层:适配无铅焊接工艺,焊接兼容性强,焊点强度满足行业标准。

3.3 机械强度

虽然封装小巧,但通过优化叠层密度和陶瓷材料配方,抗振动、冲击能力满足IEC 60068-2-6(振动:10~2000Hz,1.5g)和IEC 60068-2-27(冲击:100g,11ms)标准,适合移动设备(如智能手机、智能穿戴)的使用场景。

四、典型应用场景

该型号因体积小、温度稳定、电压适配性强,广泛应用于以下领域:

4.1 消费电子

  • 智能手机/平板电脑:主板电源滤波、摄像头模块信号耦合;
  • 智能穿戴:智能手表/手环的电池管理电路去耦;
  • 音频设备:蓝牙耳机、音箱的信号滤波(减少杂音干扰)。

4.2 工业控制

  • 小型PLC:数字输入/输出模块的信号滤波(避免电磁干扰);
  • 传感器模块:温度、压力传感器的电源去耦(稳定信号基准);
  • 小型电机驱动:低压驱动电路的电压稳定(抑制电压波动)。

4.3 通信设备

  • 小型基站:射频模块的电源滤波(提升信号纯度);
  • 路由器/交换机:端口电路的去耦电容(减少串扰)。

五、可靠性与环保标准

5.1 可靠性验证

  • 焊接可靠性:通过回流焊(260℃峰值,30s)、波峰焊(240℃峰值,5s)工艺验证,焊接不良率≤0.1%;
  • 寿命测试:在额定温度(85℃)和电压(35V)下,连续工作1000小时后容值衰减≤5%,满足工业级寿命要求;
  • 耐湿性能:通过IEC 60068-2-67(湿热循环:40℃/93%RH,1000h)测试,绝缘电阻保持在10^9Ω以上。

5.2 环保认证

符合RoHS 2.0(无铅、无镉、无汞、无六价铬)和REACH(SVHC物质管控)标准,可用于出口欧盟的产品,满足全球环保要求。

六、品牌与供应保障

HRE芯声是国内专注于被动元器件研发生产的厂商,拥有10余年MLCC生产经验,产品覆盖02011206封装、1pF100μF容值范围。CGA0201X5R104K350ET具备稳定产能,可满足:

  • 中小批量样品需求(交期1~2周);
  • 大规模量产订单(月产能可达百万级);
  • 定制化需求(如特殊温度系数、电压等级)。

综上,CGA0201X5R104K350ET是一款性价比高、适配性强的小型化MLCC,可满足大多数常规电路的设计需求,是消费电子、工业控制等领域的优选被动元件之一。

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