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CGA0201X5R104K350ET是HRE芯声推出的一款小型化多层陶瓷电容(MLCC),针对高密度贴装、温度稳定性需求设计,广泛适配消费电子、工业控制等领域的小型化设备。以下从核心属性、性能参数、应用场景等维度展开概述。
该型号属于常规中容值MLCC,核心定位为高集成度、温度稳定型被动元件,满足电路中滤波、耦合、去耦等基础功能需求。其关键属性可概括为:
容值标称100nF(标识“104”,即10×10⁴pF),精度±10%,在-55℃~+85℃范围内容值变化控制在±15%以内。此参数既满足电源滤波、信号耦合的基础容值需求,又避免了过高精度带来的成本冗余,适合批量应用。
35V直流额定电压(标识“350”,即35V),高于常见的16V、25V等级,可覆盖:
采用X5R陶瓷介质,温度范围为**-55℃~+85℃**,容值变化率≤±15%。相比Y5V(±20%以上)稳定性更强,适合温度变化较明显的户外设备、工业现场,同时比NP0(零温度系数)成本更低,是性价比最优的选择之一。
内部采用陶瓷介质层+镍电极层交替叠合(通常为数十层),既保证容值稳定,又降低了寄生电阻(ESR)和寄生电感(ESL)——ESR约为几十毫欧,ESL约为几纳亨,适合高频电路(如射频模块)的信号滤波。
采用三层端电极结构(银层→镍层→锡层):
虽然封装小巧,但通过优化叠层密度和陶瓷材料配方,抗振动、冲击能力满足IEC 60068-2-6(振动:10~2000Hz,1.5g)和IEC 60068-2-27(冲击:100g,11ms)标准,适合移动设备(如智能手机、智能穿戴)的使用场景。
该型号因体积小、温度稳定、电压适配性强,广泛应用于以下领域:
符合RoHS 2.0(无铅、无镉、无汞、无六价铬)和REACH(SVHC物质管控)标准,可用于出口欧盟的产品,满足全球环保要求。
HRE芯声是国内专注于被动元器件研发生产的厂商,拥有10余年MLCC生产经验,产品覆盖02011206封装、1pF100μF容值范围。CGA0201X5R104K350ET具备稳定产能,可满足:
综上,CGA0201X5R104K350ET是一款性价比高、适配性强的小型化MLCC,可满足大多数常规电路的设计需求,是消费电子、工业控制等领域的优选被动元件之一。
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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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