Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRE CSA0402C0G300J500GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402C0G300J500GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402C0G300J500GT
- Electronic Component
- 1
- Electronic Component
- 30pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264778594
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402C0G300J500GT 产品概述
一 技术参数
CSA0402C0G300J500GT 为 HRE(芯声) 品牌贴片多层陶瓷电容（MLCC），主要参数如下：标称电容 30 pF，精度 ±5%（J），额定电压 50 V，温度特性 C0G（又称 NP0），封装 0402（1.0 mm × 0.5 mm）。该系列为无极性元件，适用于表面贴装工艺。
二 主要特性
- C0G 温度系数接近零，电容随温度变化极小，适合需要高稳定性与低介质损耗的场合。
- 低介质损耗（高 Q 值）、低漏电与良好的频率响应，适合高频与射频电路。
- 0402 小型封装，有利于高密度 PCB 布局与微型化设计。
- 符合无铅制程的回流焊工艺要求，兼容常见 SMT 生产流程。
三 典型应用
- 高频滤波、阻抗匹配与谐振回路（RF 前端、射频模块）。
- 高稳定性定时与振荡电路、参考网络（时钟、晶振旁路）。
- 精密模拟电路（ADC/DAC 前端、传感器接口）。
- 高频旁路与去耦（在对温漂、线性度要求高的场合替代 X7R）。
四 设计与使用注意事项
- C0G 虽然比高介电常数材料对直流偏压敏感性小，但在高场强下仍应适度预留裕量，避免长期在额定电压附近工作以提高可靠性。
- 0402 尺寸对焊膏印刷与贴装精度要求较高，建议使用推荐焊盘尺寸并控制回流曲线以避免焊接缺陷。
- 尽量将去耦电容靠近电源引脚布置，缩短回流路径以发挥最佳滤波性能。
- 避免在 PCB 裙边或可能受机械应力位置装配，防止贴片受力导致压裂或性能退化。
五 可靠性与合规
HRE 生产的 MLCC 通常经过温度循环、焊接热应力和湿热测试以保证稳定性与一致性。该型号适用于民用与工业场景；若用于汽车级或特殊环境，请向供应商确认是否有 AEC-Q200 或更高等级认证。产品一般符合 RoHS 无铅环保要求，包装支持贴片卷盘（Tape & Reel）以便 SMT 自动化生产。
六 选型建议
当设计对温度稳定性、线性度、频率特性要求高时优先选择 C0G 系列电容；若需要更大电容量且对温漂容忍，则可考虑 X7R 等介质。0402 封装适合空间受限且对功率/电流要求不高的场景；若需承载更高电流或更低 ESR，可选更大封装规格。
如需获取详细电气特性曲线（温度响应、频率响应、等效串联电阻/电感）和封装尺寸图纸或样品，请提供采购量与应用场景，我可协助联系或查阅更详尽的数据表。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
