WMSIC Electronic Components

HRE CGA0402X7R272K500GT

ModelCGA0402X7R272K500GT
Package0402
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0402X7R272K500GT
Type
HRE
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0402X7R272K500GT
Electronic Component
1
Electronic Component
2.7nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.013g
Electronic Component
10
Electronic Component
BM0264596036
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0402X7R272K500GT 产品概述

一、产品简介

CGA0402X7R272K500GT 是 HRE(芯声) 提供的一款陶瓷多层片式电容,标称电容值 2.7nF,公差 ±10%(K),额定电压 50V,温度特性为 X7R,封装为 0402(即公制 1005)。该器件体积小、温度稳定性良好,适合对体积和布板密度有严格要求的消费电子、通信与工业类电路中作旁路、去耦和高频耦合等用途。

二、主要参数

  • 容值:2.7nF(272)
  • 精度:±10%(K)
  • 额定电压:50V DC
  • 温度系数/材质:X7R(-55℃ ~ +125℃,温度引起的容值变化在规格范围内)
  • 封装:0402(适合高密度贴片工艺)
  • 品牌:HRE(芯声)

三、材料与温度特性

X7R 为中高稳定性陶瓷介质,常温到高温范围内保持较小的容值漂移,适用于去耦和一般滤波。需要注意 X7R 为介质温度特性而非容差,器件在施加直流偏压时会出现一定的容值下降,具体下降量随厚度、制程和电压而异,设计时建议考虑这一点并通过样品验证。

四、典型应用场景

  • 数字/模拟电源去耦、旁路
  • 高频信号耦合与滤波
  • 声学、传感器前端的耦合电容
  • 空间受限的移动终端、可穿戴设备、模块化电源板

五、封装与焊接建议

0402 封装适合自动贴装与无铅回流焊流程。建议遵循厂家提供的回流曲线和湿度敏感等级(MSL)要求,避免超温或长时间加热。贴片时走线尽量短且粗,焊盘设计需兼顾焊接良率与力学应力分布,防止回流或后加工时产生裂纹。

六、可靠性与检测建议

建议在设计阶段进行样片电压偏置、热循环、震动和湿热测试,以评估 X7R 在系统工作条件下的容值漂移与可靠性。长期高压、冲击或机械应力会影响微小封装的可靠性,关键应用中应考虑冗余或保守降额。

七、选型注意事项

在要求极高容值稳定性或低温漂的场合,可考虑 C0G/NP0 等更稳定介质;若工作电压接近额定值或对漏电、纹波要求高,应与供应商确认实际直流偏压特性及等效串联电阻(ESR)等参数。最终选型请参照 HRE(芯声) 正式 Datasheet 与样品测试结果。

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