Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0402X7R272K500GT 是 HRE(芯声) 提供的一款陶瓷多层片式电容,标称电容值 2.7nF,公差 ±10%(K),额定电压 50V,温度特性为 X7R,封装为 0402(即公制 1005)。该器件体积小、温度稳定性良好,适合对体积和布板密度有严格要求的消费电子、通信与工业类电路中作旁路、去耦和高频耦合等用途。
X7R 为中高稳定性陶瓷介质,常温到高温范围内保持较小的容值漂移,适用于去耦和一般滤波。需要注意 X7R 为介质温度特性而非容差,器件在施加直流偏压时会出现一定的容值下降,具体下降量随厚度、制程和电压而异,设计时建议考虑这一点并通过样品验证。
0402 封装适合自动贴装与无铅回流焊流程。建议遵循厂家提供的回流曲线和湿度敏感等级(MSL)要求,避免超温或长时间加热。贴片时走线尽量短且粗,焊盘设计需兼顾焊接良率与力学应力分布,防止回流或后加工时产生裂纹。
建议在设计阶段进行样片电压偏置、热循环、震动和湿热测试,以评估 X7R 在系统工作条件下的容值漂移与可靠性。长期高压、冲击或机械应力会影响微小封装的可靠性,关键应用中应考虑冗余或保守降额。
在要求极高容值稳定性或低温漂的场合,可考虑 C0G/NP0 等更稳定介质;若工作电压接近额定值或对漏电、纹波要求高,应与供应商确认实际直流偏压特性及等效串联电阻(ESR)等参数。最终选型请参照 HRE(芯声) 正式 Datasheet 与样品测试结果。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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