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HRE CSA0402C0G100J500GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402C0G100J500GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402C0G100J500GT
- Electronic Component
- 1
- Electronic Component
- 10pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.013g
- Electronic Component
- 10
- Electronic Component
- BM0264743640
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402C0G100J500GT 产品概述
一、产品简介
CSA0402C0G100J500GT 是 HRE(芯声) 出品的一款贴片多层陶瓷电容（MLCC），标称容量 10pF，公差 ±5%（J），额定电压 50V，温度特性为 C0G（也称 NP0）。封装为 0402（约 1.0mm × 0.5mm），适配高密度表面贴装工艺，专为对精度、稳定性和低损耗有严格要求的电子电路设计。
二、主要性能特点
- 容值稳定：C0G 型材料在温度变化时几乎无电容漂移，典型温度系数接近 0±30 ppm/°C，适合精密滤波和定时电路。
- 低损耗与低噪声：介质损耗低，等效串联电阻（ESR）和介感（ESL）较小，有利于射频与高速信号路径的性能。
- 高可靠性：陶瓷基材抗老化特性好，长期电气性能稳定，适合要求长期可靠性的产品。
- 体积小、贴片方便：0402 尺寸满足高密度 PCB 布局需求，适合自动贴装、回流焊工艺。
三、推荐应用场景
- 高频射频匹配网络、耦合与旁路电容
- 高频振荡器、定时与谐振电路（对频率稳定性敏感）
- 精密模拟前端（ADC/DAC、比较器）耦合与滤波
- 移动设备、物联网模块、射频识别（RFID）与无线通信模块的关键节点
四、使用与工艺建议
- 回流焊兼容：推荐使用无铅回流焊工艺，遵循元件制造商的回流温度曲线（峰值温度与保温时间）。
- 卸载与降压：为延长寿命并避免介质击穿，建议工作电压留有余量，尽量低于额定电压的最大值。
- 贴装注意：0402 尺寸较小，贴装时应避免过大的机械应力与搬运挤压，焊接后避免强力弯曲 PCB 引起裂纹。
- 存储与干燥：遵循常规 SMD 元件储存规范，受潮后按需进行烘烤处理以防焊接缺陷。
五、封装与采购信息
CSA0402C0G100J500GT 采用标准 0402 卷带包装，适配自动贴片生产线。订购时请确认包装形式与批次，便于贴装与备料管理。如需替代或同规格型号，可参考同尺寸、相同温度特性（C0G）、相同容值与耐压的 MLCC 元件，但请在替换前校验尺寸、电气特性及可靠性要求。
如需更多规格表、焊接曲线或样品测试数据，请提供具体用途与 PCB 环境，我可协助给出更详细的选型与应用建议。
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