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HRE CSA0603X5R105K160JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0603X5R105K160JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0603X5R105K160JT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495027
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0603X5R105K160JT 产品概述
一、产品简介
CSA0603X5R105K160JT（品牌：HRE/芯声）是一款贴片多层陶瓷电容（MLCC），封装为0603（约1.6mm × 0.8mm），额定电压16V，标称电容值1µF，标称容差±10%（K），介质类型为X5R。该系列器件针对中低电压、电源去耦和滤波场景优化，兼顾体积与容量的平衡，适合高密度贴装的现代电子设备。
二、主要参数
- 电容：1 µF
- 精度：±10%（K）
- 额定电压：16 V DC
- 介质：X5R（工作温度范围一般为-55°C ~ +85°C，温度特性允许一定的容量变化）
- 封装：0603（尺寸约1.6 × 0.8 mm）
- 封装形式：贴片（卷带式包装，适配自动贴片机）
三、性能特点
- 体积小、容量密度高，适合空间受限的板级设计。
- X5R介质在中温区有较好的介电常数稳定性，能提供比NP0更高的容量密度。
- 良好的高频特性与低阻抗特性，适用于去耦、旁路和EMI滤波。
- 适合无铅回流焊工艺，可靠性经过常规焊接循环验证。
- 需注意X5R的直流偏置效应：随着偏置电压增加，实际有效容量会降低，设计时应考虑该因素。
四、典型应用
- 数字电源去耦与稳压电源旁路
- 手机、平板、可穿戴与物联网终端的电源滤波
- 通信设备、消费电子、传感器模块的去耦与旁路
- 一般工业与商用电子设备的滤波与储能场景（非高精度时基元件）
五、可靠性与封装
- 常见卷带（tape-and-reel）包装，便于SMT自动贴装与批量生产。
- 适用标准回流焊工艺，满足常规焊接温度曲线要求。
- X5R陶瓷材料在热循环与机械应力下表现良好，但需注意在过度弯曲或长期高应力环境下的裂纹风险；设计PCB时建议合理布线与焊盘设计以降低机械应力集中。
六、选型及使用建议
- 若工作电压接近或超过器件额定电压，应选更高额定电压型号以避免容量大幅下降或失效。
- 在对实际有效容量有严格要求的场合（如电容计量或高精度滤波），应评估DC bias与温度特性带来的变化。
- 布局时尽量靠近电源脚、缩短走线并减小回路面积，以获得最佳去耦效果。
- 对于大电流旁路或稳压输入，考虑并联低ESR电容以改善瞬态响应和降低等效串联电阻（ESR）。
如需样片、封装3D模型或更详细的电气特性（温度/频率曲线、直流偏置特性、老化行为等），可联系供应商或查看器件详细规格书。
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