WMSIC Electronic Components

HRE CGA0402X7R102K250GT

ModelCGA0402X7R102K250GT
Package0402
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0402X7R102K250GT
Type
HRE
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0402X7R102K250GT
Electronic Component
1
Electronic Component
1nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.013g
Electronic Component
10
Electronic Component
BM0265156197
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0402X7R102K250GT多层陶瓷电容产品概述

CGA0402X7R102K250GT是HRE(芯声)品牌推出的通用型多层陶瓷电容(MLCC),凭借小体积、宽温稳定、高可靠性等特点,广泛应用于消费电子、工业控制等领域的滤波、耦合等电路,是中小功率电子设备的常用基础元件。

一、产品基本信息

该型号MLCC的核心参数可通过型号命名直接对应,关键信息如下:

  • 容值:1nF(型号中“102”代表10×10²pF=1000pF=1nF);
  • 精度:±10%(型号中“K”为精度代码);
  • 额定电压:25V直流(型号中“250”代表25V);
  • 温度系数:X7R(温度特性分类);
  • 封装:0402(英制尺寸,公制对应1005,即1.0mm×0.5mm);
  • 品牌:HRE(芯声);
  • 类型:无极性多层陶瓷电容。

二、核心技术参数详解

2.1 容值与精度

1nF±10%的容值范围(0.9nF~1.1nF),覆盖了大多数电路对中等容值滤波、耦合的需求。精度等级适合非精密测量类应用,平衡了性能与成本,避免过度冗余。

2.2 额定电压

25V直流额定电压是该电容的安全边界,使用时需确保电路工作电压(直流或交流峰值)不超过25V。若为交流电压,需按峰值换算(如交流17.7V峰值对应25V直流),避免陶瓷介质击穿导致失效。

2.3 温度系数X7R

X7R是MLCC的主流温度特性之一,定义为:工作温度范围-55℃~+125℃,容值变化率≤±15%。相比Y5V(容值变化±20%~+80%)等类型,X7R的温度稳定性显著提升,能适应温度波动较大的工作环境(如工业现场、车载辅助电路)。

2.4 封装尺寸

0402封装(1.0mm×0.5mm)属于小型贴片封装,适配高密度PCB设计,可有效减少设备体积,满足智能手机、智能穿戴等便携设备的小型化需求。

三、典型应用场景

该电容因参数适配性强,广泛应用于以下场景:

  1. 消费电子:智能手机、平板电脑、智能手表的电源滤波(去除电源纹波)、信号耦合(隔离直流、传递交流信号);
  2. 工业控制:小型PLC模块、传感器信号调理电路的滤波(抑制电磁干扰)、定时电路的容值补偿;
  3. 通信设备:小型路由器、智能家居网关的射频前端滤波(过滤杂波)、电源模块的去耦;
  4. 车载辅助电路:车载音响、仪表盘辅助电路的信号滤波(工作温度适配汽车环境的-40℃~+85℃波动)。

四、产品优势特点

  1. 小体积高密度:0402封装大幅节省PCB空间,支持设备小型化、轻量化设计,尤其适合便携电子设备;
  2. 宽温稳定可靠:X7R温度特性确保-55℃~+125℃范围内容值波动小,避免因温度变化导致电路性能漂移;
  3. 无极性易焊接:多层陶瓷结构无极性,贴片焊接兼容性好,回流焊工艺成熟,生产效率高;
  4. 性价比突出:HRE芯声的通用型产品,性能稳定且成本适中,适合批量应用于中低端至中端电子设备。

五、使用注意事项

  1. 电压限制:严禁工作电压超过25V直流,避免介质击穿;
  2. 温度范围:使用环境温度需控制在-55℃~+125℃以内,超出范围可能导致容值漂移或介质老化;
  3. 焊接工艺:遵循HRE推荐的回流焊温度曲线(峰值温度230℃240℃,时间3060秒),避免过热损坏电容;
  4. 存储条件:常温干燥环境存储(温度≤40℃,湿度≤60%),开封后尽快使用,避免受潮影响焊接性能。

该产品作为HRE芯声的通用MLCC,能满足多数电子设备的基础电容需求,是设计中实现滤波、耦合功能的可靠选择。

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