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HRE CSA0402C0G220J500GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402C0G220J500GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402C0G220J500GT
- Electronic Component
- 1
- Electronic Component
- 22pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264495035
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402C0G220J500GT 产品概述
一、产品简介
CSA0402C0G220J500GT 是 HRE(芯声) 系列的贴片多层陶瓷电容（MLCC），标称容量 22 pF，容量公差 ±5%，额定电压 50 V，介质为 C0G（又称 NP0），封装尺寸 0402（公制 1005）。该器件具有低损耗、高稳定性与优良的温度系数，适用于对频率稳定性和低介质损耗有较高要求的电路。
二、主要参数
- 电容值：22 pF
- 容差：±5%（J）
- 额定电压：50 V DC
- 介质：C0G / NP0（近似 0 ppm/°C，通常 ≤ ±30 ppm/°C）
- 封装：0402（1.0 mm × 0.5 mm）
- 包装形式：卷带（Tape & Reel，型号后缀 GT 表示卷带包装）
三、核心特性
- 热稳定性好：C0G 介质在宽温度范围内电容变化极小，适合精密电路。
- 损耗低：介质损耗（DF）极低，Q 值高，适合 RF 与微波前端。
- 小尺寸：0402 封装实现高密度布板、减小寄生电感与电容。
- 耐电压与耐久性：额定 50 V，满足多数模拟与数字电路的滤波与旁路需求。
四、典型应用场景
- 高频滤波、阻抗匹配与谐振网络（RF 前端、天线匹配）
- 时钟与振荡器电路（石英滤波网络）
- 精密模拟前端（传感器、放大器旁路与耦合）
- 高频通讯设备、测量仪器、汽车电子（在符合温度与应力要求下）
五、封装与使用建议
- PCB 布局：短且对称的焊盘，有利于降低寄生电感。
- 过孔与过渡：避免将 0402 放置在需要大量热循环或机械应力的区域。
- 搭配：在高频应用中与串联电阻或共模元件合理配合以优化匹配。
六、焊接与可靠性
- 焊接建议：遵循无铅回流曲线，峰值温度约 250–260°C（参考工厂资料与 JEDEC 指南），避免超温或长时间停留。
- 可靠性测试：应通过热循环、湿热、机械冲击与振动等行业规范测试以验证在目标应用下的寿命与稳定性。
- ESD 与极性：MLCC 无极性，但在装配与测试过程中应注意防止过压与机械损伤。
七、选型与采购提示
- 型号含义一般按“系列-封装-介质-电容值-精度-额定电压-包装”排列，购买时请确认完整料号与包装单位（卷带长度）。
- 替代考虑：同规格的 C0G 0402 22 pF ±5% 50 V 可互换，但需验证尺寸、厚度与可靠性认证（如 AEC-Q200 对汽车级要求）。
如需更详细的电气模型（寄生电感、等效串联电阻 ESR/ESL）、回流曲线与可靠性报告，可提供具体应用场景以便给出更精准的建议。
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