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HRE CSA0603C0G120J500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0603C0G120J500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0603C0G120J500JT
- Electronic Component
- 1
- Electronic Component
- 12pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495039
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0603C0G120J500JT 产品概述
一、产品简介
CSA0603C0G120J500JT 为 HRE（芯声）系列贴片多层陶瓷电容（MLCC），标称容量 12 pF，容差 ±5%（J），额定电压 50 V，介质类别为 C0G（亦称 NP0），封装尺寸 0603（约 1.6 mm × 0.8 mm）。该器件属于一类温度稳定、低损耗的精密类电容，适用于对容量稳定性和低温漂有较高要求的电路。
二、主要性能特点
- 温度特性：C0G / NP0 型，温度系数接近 0，典型值约 ±30 ppm/℃ 量级，工作温度范围宽，容量随温度变化极小。
- 介质损耗低：耗散因子（DF）很低，适合高 Q、低噪声应用。
- 电压特性优良：在偏压下容量变化小，适合直流偏压存在的高频电路。
- 尺寸小、可靠性高：0603 封装便于高密度贴装与自动化生产。
- 环保合规：可满足常见的无铅（RoHS）环保要求。
三、典型应用
- 高频滤波、射频匹配网络与谐振回路
- 振荡器与时钟电路的负载/补偿电容
- 精密模拟电路、采样保持电路和电压参考旁路
- 高速数字电路中的终端与去耦（小容量局部去耦）
四、设计与装配建议
- 推荐遵循 JEDEC/IPC 标准的无铅回流焊工艺，回流温度曲线按 PCB 与元件厂商指导进行。
- 贴装时注意避免 PCB 弯曲与机械应力集中，以防开裂；焊盘设计与过孔布局应保持良好焊接饱满性。
- 清洗时优选对陶瓷无腐蚀影响的溶剂，避免强酸碱介质长时间作用。
- 对于精密应用，建议在评估中测量温度与偏压下的实际容量变化。
五、存储与可靠性
- 建议干燥、避光、防潮保存，环境温度与湿度控制在厂家推荐范围内。
- MLCC 一般不存在显著随时间老化（相较于高介电常数材料），C0G 更具长期稳定性。
- 运输、贴装与测试过程中应采取一般静电防护措施及合理的机械防护。
六、订购与型号说明（参考）
CSA0603C0G120J500JT 为 HRE（芯声）系列型号标识，通常以带装（tape & reel）方式供应，具体包装数量、库存与交期请向供应商确认。若需替代型号或批量技术支持，可提供 PCB 布局建议与应用测试资源。
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