Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRE CGA0805X7R103K500KT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X7R103K500KT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X7R103K500KT
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0264778591
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X7R103K500KT 产品概述
一、产品简介
CGA0805X7R103K500KT 为 HRE（芯声）品牌贴片多层陶瓷电容（MLCC），标称电容值 10nF，初始精度 ±10%，额定工作电压 50V，介质材料为 X7R，封装规格为 0805（≈2.0 × 1.25 mm）。该型号定位为通用型中介电常数陶瓷电容，兼顾成本与性能，适用于电源去耦、滤波、耦合和旁路等常见应用。
二、电气与温度特性
- 电容值：10nF（标称）
- 初始公差：±10%
- 额定电压：50V DC
- 介质：X7R（温度特性 -55°C ~ +125°C，在该温度范围内电容变化在 ±15% 以内，实际电路中需考虑偏差）
- 绝缘电阻与介质损耗随频率和温度变化，X7R 在中低频下保持较低损耗，适合去耦与旁路用途
三、封装与机械特性
- 封装：0805（英制 0.08″×0.05″，公制约 2.0×1.25 mm），适用于大批量 SMT 生产
- 机械可靠性：良好的尺寸稳定性与焊接适应性，适合回流焊工艺，建议按厂家回流曲线控制峰值温度与升温速率
- 包装形式：通常为卷带（T&R），便于自动贴片生产与库存管理
四、典型应用场景
- 开关电源与稳压器输出旁路/去耦
- 模拟前端滤波与耦合电路
- 数字电路电源去耦（TTL、MCU、FPGA 等）
- 通信设备、消费电子、工业控制等对成本与性能平衡的场合
五、使用与布局建议
- 去耦时尽量靠近 IC 电源引脚放置，焊盘到电容引脚的走线应最短、最粗以降低寄生电感
- 若用于高频旁路，可与低 ESR/低 ESL 的电容并联以优化频率响应
- 在焊接与机械应力方面，避免在 PCB 弯曲区域放置大数量 MLCC，防止芯片裂纹
- 参考厂家回流焊规范，避免过高峰值温度或超出推荐的热循环次数
六、质量与采购提示
HRE（芯声）提供的产品通常符合 RoHS 要求并支持大宗贴片供应。采购时注意确认批次、包装方式及出厂测试报告（如可用），并进行首件或批量测试以确保与系统兼容。标准订货型号 CGA0805X7R103K500KT，便于在物料清单（BOM）中唯一识别。
如需针对特殊温度、频率或寿命要求的替代型号，可依据电压、介质类型（C0G/NP0、X7R、X5R 等）与封装尺寸进行选择和比较。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
