Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRE CGA0603C0G302J500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603C0G302J500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603C0G302J500JT
- Electronic Component
- 1
- Electronic Component
- 3nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0265109120
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603C0G302J500JT 产品概述
一、产品简介
CGA0603C0G302J500JT 为 HRE（芯声）系列 0603 封装多层陶瓷电容器，标称容值 3nF（302），容差 ±5%（J），额定电压 50V，介质为 C0G（又称 NP0）。该产品面向对温度稳定性、线性度和低损耗有较高要求的精密模拟与高频电路，兼顾小型化封装的安装便利性。
二、主要性能特点
- 温度系数：C0G（近似 0 ppm/°C，典型范围 ±30 ppm/°C），温度稳定性优异；
- 容值与偏差：3nF，±5%（J），适合要求较高容差的滤波、耦合场合；
- 低损耗、低漏电与优良的频率特性，适用于高频及时钟、振荡器回路；
- 紧凑封装：0603（约 1.6 × 0.8 mm），适合高密度贴片布局；
- 温度范围宽：一般工作温度 -55°C 至 +125°C，可靠性高、长期稳定。
三、典型电气参数（参考）
- 标称电容：3.0 nF
- 容差：±5%（J）
- 额定电压：50 V DC
- 介质：C0G/NP0（线性、低介质吸收）
- 封装：0603（约 1.6 × 0.8 mm）
（注：具体电气参照厂方数据表为准）
四、典型应用场景
- 精密滤波与定时电路（RC 时间常数场合）；
- 高频耦合/去耦、射频匹配网络与谐振回路；
- 模拟前端、采样保持、ADC/DAC 去耦；
- 工业与消费类电子中对温漂要求严格的场合。
五、安装与工艺建议
- 推荐采用回流焊工艺，遵循 IPC/J-STD-020 温度曲线，最大回流峰值一般 ≤ 260°C；
- 布局时避免在电容两端施加机械应力，过渡位移或孔位紧邻可能导致裂纹；
- 焊盘设计应与制造商推荐的焊盘尺寸匹配，确保焊点充足并降低热应力；
- 对于高可靠性应用，建议在样机阶段进行热循环、振动和机械应力测试验证。
六、选型与订购信息
- 型号解析示例：CGA0603C0G302J500JT —— CGA0603（封装/系列） C0G（介质） 302（3.0nF） J（±5%） 500（50V） JT（包装/卷带编码）；
- 订购时请参考批次、包装（卷带长度）与出货要求，如需样品或量产支持可与厂家或代理商沟通样品测试与长期供货计划。
如需完整数据手册、温度与频率特性曲线、封装图纸或可靠性认证（如 AEC‑Q200 等），可提供序列号或批次向供应商索取详细资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
