WMSIC Electronic Components

HRE CGA0805X7R105M500MT

ModelCGA0805X7R105M500MT
Package0805
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0805X7R105M500MT
Type
HRE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0805X7R105M500MT
Electronic Component
1
Electronic Component
1uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0264495102
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0805X7R105M500MT —— HRE(芯声) 1µF ±20% 50V X7R 0805 贴片电容 产品概述

一、产品概述

CGA0805X7R105M500MT 为 HRE(芯声) 系列多层陶瓷贴片电容(MLCC),额定电容 1µF,公差 ±20%(M),额定电压 50V,介质类型 X7R,封装 0805(公制 2012,约 2.0 × 1.25 mm)。该器件适用于要求稳定介电特性与中等容量的去耦、电源滤波与一般旁路场合。

二、主要规格参数

  • 容值:1.0 µF
  • 精度(公差):±20%(M)
  • 额定电压:50 V DC
  • 介质温度系数:X7R(−55°C ~ +125°C,容值随温度变化一般在 ±15% 范围内)
  • 封装:0805(2.0 × 1.25 mm)
  • 引脚类型:无引线,表面贴装(SMD/SMT)
  • 使用温度范围:典型 -55°C 至 +125°C(具体请参阅完整数据手册)

三、性能特点

  • 体积小、容量集中:0805 封装在体积受限电路中能提供 1µF 的储能能力。
  • 良好温度稳定性:X7R 在宽温度范围内保持较稳定的电容值,适合大多数模拟与数字电源旁路。
  • 适用高压场合:50V 额定电压适用于中低压电源滤波与耦合应用。
  • 高可靠性与可量产性,适配自动贴装工艺。

四、典型应用

  • 数字/模拟芯片的电源去耦与旁路
  • DC-DC 转换器输入/输出滤波
  • 信号耦合与去耦电路(对温度/电压敏感度中等)
  • 消费电子、通信设备、工业控制板、汽车电子(请确认汽车级可靠性要求)

五、设计与使用建议

  • 注意 DC 偏压与电容温度/电压依赖性:X7R 在高电压偏置下容值会下降,设计留有裕量。
  • 去耦时建议并联不同容值(如 0.1µF 与 1µF)以覆盖更宽频带。
  • 尽量靠近 IC 电源引脚放置,缩短焊盘到元件的走线长度以降低寄生阻抗。
  • 推荐遵循厂家回流焊温度曲线,常见为峰值 240–260°C 的无铅回流配置。

六、封装与采购信息

  • 封装形式:卷带托盘(Tape & Reel),适用于 SMT 自动贴装。
  • 包装数量与编码请以 HRE 正式数据手册或供应商报价单为准。
  • 订购时请注明完整料号(CGA0805X7R105M500MT)、批号与需要的回流工艺信息。

七、储存与可靠性注意事项

  • 建议按防潮包装存放,开盘后短时间内使用或回潮后按标准回流前烘烤处理。
  • 避免机械应力,贴装时注意焊盘设计与应力缓冲,防止裂纹导致失效。
  • 对关键或极端环境应用(高温、振动、汽车等级)建议进行样品验证与可靠性测试。

注:本文为产品概述与应用建议,详细电学参数(等效串联电阻 ESR、自谐频率、容值随 DC 偏置曲线、寿命与可靠性试验数据)请参照 HRE(芯声) 官方数据手册或向供应商索取技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.