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HRE CGA0805X5R225K500MT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X5R225K500MT
- Type
- HRE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X5R225K500MT
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0264743632
- Electronic Component
- X5R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X5R225K500MT 产品概述
一、产品简介
CGA0805X5R225K500MT（品牌：HRE / 芯声）是一款贴片多层陶瓷电容（MLCC），额定电容值2.2µF，容差±10%（K），额定电压50V，介质材料为X5R，封装尺寸0805（约2.0 × 1.25 mm）。该型号兼顾较大电容量与小型化封装，适用于对旁路、去耦及能量存储有中等温度稳定性要求的电子产品。
二、主要特性
- 电容：2.2µF ±10%；
- 额定电压：50V DC，适用中高压应用场景；
- 温度系数：X5R（-55°C 至 +85°C 范围内电容变化在规范允许范围内）；
- 封装：0805 贴片，适合自动贴装和回流焊工艺；
- 低等效串联电阻与较小体积，适合高密度布局。
三、电气与热性能说明
X5R介质在常用温度范围内具有良好的电容保持性，但相比NP0/C0G类温度稳定性较差，电容会随温度和直流偏压发生变化。使用时注意DC bias效应：在接近额定电压下，实际可用电容会下降，建议在设计时考虑裕量或采用并联方案以确保系统稳定。工作温度范围与X5R特性相符，常见应用环境内表现稳定。
四、封装与机械性能
0805小尺寸便于在高密度PCBA上布置。HRE生产工艺保证了良好的焊接性和机械强度。为避免裂纹或损伤，贴装时注意降压、合理回流曲线与PCB边缘的机械应力控制。推荐采用标准回流焊工艺（遵循HRE的回流温度曲线），并保证贴装前器件干燥、无污染。
五、典型应用场景
- 电源去耦、旁路电容，改善瞬态响应；
- DC–DC转换器输出滤波与储能；
- 模拟电路与射频前端的电源支撑（非高精度滤波场合）；
- 工业控制、通讯设备、消费电子等对体积与电容密度有要求的场合。
六、使用注意与可靠性建议
- 考虑直流偏压与温度对电容的影响，必要时留有裕量或并联低损耗电容；
- 遵循制造商推荐的回流焊温度曲线，避免超温或过长加热时间；
- PCB布局时避免在焊点附近施加过大机械应力，避免在安装过程中弯折或敲击；
- 存储时保持干燥，长期暴露于潮湿环境可能影响后续焊接质量，建议按元件保存规范存放。
七、采购与替代方案
CGA0805X5R225K500MT 以HRE（芯声）品牌供应，常见包装形式为卷带供自动贴装。若需替代，可考虑同规格（0805、2.2µF、50V、X5R、±10%）的同类MLCC产品，但在替换时请核对尺寸、电压、温度特性及DC bias表现，确保系统兼容性。
如需更详细的电气特性曲线（温度特性、DC bias曲线、ESR/ESL测量）或回流焊指导文件，可提供具体需求以便获取产品数据表和可靠性测试报告。
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