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HRE CGA0402C0G100J500GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0402C0G100J500GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0402C0G100J500GT
- Electronic Component
- 1
- Electronic Component
- 10pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.013g
- Electronic Component
- 10
- Electronic Component
- BM0264495118
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0402C0G100J500GT 产品概述
一、概述
CGA0402C0G100J500GT 为 HRE(芯声) 系列高稳定性多层陶瓷电容器，标称容值 10 pF，精度 ±5%（J），额定电压 50 V，温度系数为 C0G（又称 NP0），封装 0402（1005 公制）。该器件属于一类（Class I）陶瓷电容，具备极小的温度漂移和优良的介质损耗，适用于对频率稳定性和容值稳定性要求高的电路。
二、主要特性
- 容值：10 pF，公差 ±5%（J）
- 额定电压：50 V DC
- 温度系数：C0G（近似 0 ±30 ppm/°C），温度稳定性优良
- 封装：0402（小型化，适合高密度 PCB）
- 损耗角正切和 ESR 低，Q 值高，适合射频与高精度模拟电路
- 机械与电气可靠性高，适应自动化贴装与回流焊工艺
三、典型应用
- 高频射频匹配网络、谐振回路与滤波器
- 时钟振荡器、相位锁定环（PLL）与频率合成器中的定容元件
- 精密滤波、取样电路及要求容值稳定的模拟前端
- 高频旁路、耦合与去耦（小容值场景）
- 通信、测试测量、航空航天与精密仪器等对温漂要求严格的领域
四、安装与焊接建议
- 推荐使用与 0402 封装相匹配的 PCB 焊盘，避免焊盘过大导致应力集中。
- 回流焊：遵循通用无铅回流曲线，峰值温度通常不超过 260°C，建议缩短高温保持时间并尽量减少多次回流次数。
- 贴装注意避免在贴片过程中、回流后或使用过程中对元件施加弯曲应力，以免产生裂纹。
- 清洗时优先选用对陶瓷和封装材料兼容的溶剂，避免长时间超声清洗。
五、可靠性与储存
- C0G/NP0 陶瓷材料本身具有极好的长期稳定性与低吸湿性，但仍需避免剧烈机械冲击与热冲击。
- 建议在干燥环境（相对湿度 < 60%）下保存，未开封时按厂家包装建议保存以防潮。
- 使用中如需在高电压环境长期工作，应考虑电压分布与局部场强，虽为 50 V 额定，但避免长时间接近额定上限引起失效风险。
六、选型与替代建议
- 若需要更高电压耐受性，可选择同尺寸更高额定电压的型号；若对容值稳定性要求更高或更低损耗，可继续选择 C0G 系列不同容值或更大尺寸产品。
- 替代时注意匹配容值、精度、温度系数与封装尺寸，尽量选择同类 Class I 陶瓷产品以保证性能一致性。
如需器件的详细电气参数（如介质损耗、绝缘电阻、耐电压试验值、封装尺寸 3D 图等）或样片、样式包装（盘带数量、卷装等）信息，可提供进一步的资料与技术数据表。
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