WMSIC Electronic Components

HRE CGA0805X7R475K160MT

ModelCGA0805X7R475K160MT
Package0805
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0805X7R475K160MT
Type
HRE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0805X7R475K160MT
Electronic Component
1
Electronic Component
4.7uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0264495127
Electronic Component
X7R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0805X7R475K160MT 产品概述

一、产品简介

CGA0805X7R475K160MT(品牌:HRE / 芯声)是一款0805封装的多层陶瓷电容(MLCC),标称容量为4.7µF,容量精度±10%,额定电压16V,介质为X7R。该系列以小体积、高容值、高贴片兼容性为特点,适用于板上去耦、滤波与旁路等常用电路需求。

二、主要特性

  • 容值:4.7µF,适合中等容量需求的电源去耦与储能用途。
  • 精度:±10%(K),便于在一般电子设计中满足容值容差要求。
  • 额定电压:16V,适配常见单节锂电池与中低压电源轨。
  • 介质:X7R(温度特性),工作温度范围宽(典型为−55°C至+125°C,温度引起的容值变化在X7R规范范围内);相比NP0/C0G,X7R在体积和容值上更有优势,但为Ⅱ类材料,存在温度与偏压依赖性。
  • 封装:0805(2012公制),适用于自动贴装、高密度布局。

三、典型应用

  • 电源去耦与旁路(稳压器输入/输出、PMIC旁路)
  • 滤波与纹波抑制(DC-DC转换器)
  • 移动设备、消费电子、物联网终端与通信类模块的电源去耦
  • 一般耦合/旁路场合(非高精度振荡或计时电路)

四、使用注意事项与推荐

  • 直流偏压与容量衰减:X7R类高介电常数电容在施加直流偏压时会出现容量下降,具体衰减与工作电压、尺寸、制造工艺有关。设计时应留有容量裕量或在关键电路中采用降额(例如根据实际需求适度降低工作电压或提高额定容值)。
  • 温度影响:X7R在低温或高温下容值会变化,非适用于对温度稳定性有严格要求的精密时间基或滤波电路。
  • 焊接与回流:建议按无铅回流工艺(遵循J-STD-020)进行,峰值温度不超出器件耐受范围(一般≤260°C);避免重复多次高温回流以降低裂纹风险。
  • 机械应力:0805封装对焊盘设计与加工应力敏感,避免过度弯曲、强力擦洗或不合适的焊膏印刷,遵循厂方推荐的PCB焊盘与焊膏量。
  • 贮存与湿度控制:长时间暴露于潮湿环境后建议进行烘烤以防焊接过程中产生焊球或湿裂。按现场工艺控制湿敏等级(MSL)和存储条件。

五、包装与质量保障

CGA0805X7R475K160MT通常以SMT卷带(Tape & Reel)形式供货,便于高速贴片机直接上料。HRE(芯声)提供出厂检验与可靠性资料,符合常规电子元件进货检验要求,客户可根据需求索取批次检测报告与可靠性测试记录。

六、总结

该型号将0805小型化封装与4.7µF较大容值结合,适用于对体积敏感且需中等去耦能力的电源与信号应用。设计时需注意X7R材料的直流偏压与温度依赖性,合理预留裕量并遵循封装与回流工艺要求,能够在移动终端、通信与消费类电子产品中发挥良好的去耦与滤波作用。若有频率响应、ESR/ESL或高压偏置特性等更详细参数需求,建议向供应商索取完整技术资料与测量曲线以辅助最终设计选型。

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