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HRE CGA0805X5R106M500MT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X5R106M500MT
- Type
- HRE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X5R106M500MT
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0264778619
- Electronic Component
- X5R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X5R106M500MT 产品概述
一、产品简介
CGA0805X5R106M500MT 为贴片多层陶瓷电容（MLCC），标称容量 10 µF，公差 ±20%（M），额定工作电压 50 V，介质类型 X5R，常见封装 0805（约 2.0 mm × 1.25 mm）。本型号适合对体积、成本有要求的中高电压去耦、旁路与储能场合。
二、主要规格与结构
- 电容值：10 µF
- 精度：±20%（M）
- 额定电压：50 V DC
- 介质：X5R（温度系数等级）
- 封装：0805（2012公制，约 2.0×1.25 mm）
- 形态：表面贴装，多层陶瓷结构，适配自动贴装与回流焊工艺
三、电气与热学特性
X5R 介质适用于 -55°C 至 +85°C 范围内的常温应用，温度变化对电容有一定影响但属 X5R 等级允许范围。需注意 MLCC 在直流偏置下会产生容量衰减（DC-bias effect），在靠近额定电压工作时实际有效电容量会显著下降；在高频场合其高频响应与等效串联电感（ESL）也会影响性能。
四、典型应用场景
- 开关电源输入/输出滤波与旁路
- 电源总线去耦与局部储能（中高压电源轨）
- 工业控制、通信设备与消费类电子的电源模块
- 与小容量高速电容并联，用于宽频带去耦
五、设计与使用建议
- 在布板时尽量靠近供电引脚，走线短且宽，减少寄生感抗；必要时并联小值低ESL电容以改善高频性能。
- 设计时考虑 DC-bias 与温度影响，预留裕量或选择更高额定电压/更大容量以保证实际需求。
- 兼容无铅回流焊（建议遵循厂家回流曲线，最高回流温度一般不超过 260°C），避免机械弯曲或应力集中以降低裂纹风险。
- 对于振动或热循环严苛的应用，建议进行可靠性评估或选择专门的高可靠性封装/等级。
六、包装与可靠性
该类产品通常采用卷带供货，适合自动化贴装。多层陶瓷电容具有良好的长期稳定性与批量一致性，但具体寿命与可靠性指标（如热循环、湿气测试、焊接热耐受）应参照供应商的详细技术资料和认证报告，必要时进行实际工况验证。
总结：CGA0805X5R106M500MT（HRE 芯声）以其紧凑封装和 50V/10µF 的规格，适合空间受限且需中高电压去耦或储能的电子设计，选型时应重点考虑 DC-bias、温度特性与布局工艺，以确保系统性能与可靠性。
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