WMSIC Electronic Components

HRE CGA0805X5R475K250MT

ModelCGA0805X5R475K250MT
Package0805
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0805X5R475K250MT
Type
HRE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0805X5R475K250MT
Electronic Component
1
Electronic Component
4.7uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0264495162
Electronic Component
X5R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0805X5R475K250MT 产品概述

一、产品简介

CGA0805X5R475K250MT 为 HRE(芯声)品牌的一款多层陶瓷贴片电容,容量 4.7 µF,标称精度 ±10%,额定电压 25 V,介质材料为 X5R,封装为 0805(等同于 2012 米制尺寸,约 2.0 mm × 1.25 mm)。该型号在体积与容量之间取得良好平衡,适用于中小功率电子电路的去耦、旁路与滤波等场合。

二、主要参数

  • 容值:4.7 µF
  • 公差:±10%(K)
  • 额定电压:25 V
  • 温度特性:X5R(-55℃ 至 +85℃,介电变化在规定范围内)
  • 封装:0805(2012)贴片封装
  • 品牌:HRE(芯声)
  • 型号:CGA0805X5R475K250MT

三、性能特点

  • 体积小、容值高:在 0805 尺寸下提供 µF 级电容,便于高密度布板。
  • 温度稳定性适中:X5R 类介质在常用温度范围内保持较稳定容量,适合电源去耦与滤波。
  • 良好可靠性:适配表面贴装自动化生产,兼容无铅回流焊工艺(建议按 J-STD-020 回流曲线,峰值温度约 260℃)。
  • 偏压与老化特性需注意:高介电常数陶瓷在接近额定电压时存在显著偏压导致的有功容值下降;此外,X5R 属于二类介质,会有随时间的老化效应,设计时需预留裕量。

四、典型应用

  • 电源去耦与旁路(DC-DC 转换器、稳压电源)
  • 电源滤波与能量旁路
  • 音频与模拟电路的旁路/耦合(在允许的偏压与温度条件下)
  • 移动设备、通信设备、工业控制与通用电子设备的贴片应用

五、封装与焊接建议

  • 0805(2012)尺寸,建议按厂商推荐焊盘布局预留焊接可靠性。
  • 遵循无铅回流焊规范,峰值温度与时间按 J-STD-020 控制,避免重复高温循环。
  • 对于装配前可能的湿度敏感性,按包装上的等级进行预烘(若规定)。

六、设计注意事项

  • 偏压效应:在实际工作电压接近 额定电压 时,实际容值会下降,关键电路建议评估偏压-容值曲线或选用更高电压等级电容以保证裕量。
  • 温度与频率响应:X5R 在极端温度下容值会有变化,滤波环路在频率特性上需验证实际电容的有效容值与等效串联阻抗(ESR/ESL)。
  • 老化与可靠性:X5R 存在介电老化,应在可靠性要求高的场合考虑老化补偿或额外裕量。

七、采购与替代

  • 型号完整:CGA0805X5R475K250MT(HRE/芯声)
  • 如需更高稳定性或更小偏压效应,可考虑 C0G/NP0 或更高电压等级的 X5R/X7R 器件作为替代。
  • 详情参数、偏压-容值曲线及可靠性试验数据建议查阅 HRE 官方数据手册或联系供应商获取样品与器件规格文件。

如需我帮忙查找数据手册、偏压曲线或对比替代型号,可告知使用环境(工作电压、温度、频率、关键指标),我将给出更有针对性的建议。

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