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HRE CGA0805X7R105K101MT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X7R105K101MT
- Type
- HRE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X7R105K101MT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264596026
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X7R105K101MT 产品概述
一、产品简介
CGA0805X7R105K101MT（品牌：HRE/芯声）是一款0805封装的贴片多层陶瓷电容（MLCC），标称电容值1.0 μF，公差±10%（K），额定电压100 V，介质材料为X7R。器件体积小、耐压高，适用于空间受限且需要中等容量与高耐压的电子电路。
二、主要特点
- 额定电压高：100 V，适合工业电源、LED驱动、电源模块等高压应用。
- 温度稳定性：X7R介质，工作温度范围常规为 -55°C 至 +125°C，温度下电容特性稳定，适用于一般温度波动环境。
- 低等效系列电感/低ESR：适合去耦、滤波与中频旁路。
- 标准0805封装（约2.0 × 1.25 mm），兼容主流贴片工艺与自动化装配。
- 可靠包装：卷带式（Tape & Reel），便于SMT下线生产。
三、电气与机械参数（典型）
- 标称电容：1 μF ±10%（25°C，0 V偏压）
- 额定电压：100 V DC
- 介质：X7R（温度系数及性能符合X7R等级要求）
- 封装尺寸：0805（约2.0 × 1.25 × 0.9 mm）
- 介质特性：X7R在温度范围内电容变化典型≤±15%；陶瓷类存在老化与直流偏压效应，实际电容量随时间与偏压可能下降。
四、典型应用
- 开关电源滤波与输出电容（中低频旁路/储能）
- 工业电源与驱动电路（高压去耦）
- LED驱动与照明电源系统
- 逆变器、小功率变换器和电池管理系统的旁路/稳定电路
五、PCB布局与装配建议
- 为获得最佳焊接可靠性与电气性能，请遵循制造商推荐的焊盘尺寸与回流曲线；常见回流最高温度不超过JEDEC规定（≈260°C）。
- 对于高电流/高频应用，靠近IC电源引脚放置以最小化寄生阻抗。
- 受直流偏压影响明显的应用，应在样机阶段测量实际工作电压下的有效电容量，并预留裕量。
- 存储与搬运时避免剧烈振动与强酸碱环境，贴片前保持干燥，若有需要遵循干燥烘烤规范以避免焊接缺陷。
六、可靠性与包装
- 常规可靠性测试涵盖温度循环、湿热、耐焊接热、机械冲击与振动等。X7R为Class II陶瓷，长期使用中会有可预测的老化现象（典型老化率小于百分数级/十倍时间）。
- 出货一般为卷带包装（7"或13"卷盘），便于贴片机直接取料。
七、选型与注意事项
- 选型时注意直流偏压下的电容降额：高静电压或直流偏压场合，1 μF在实际工作电压下可能显著低于标称值，应依据电路需求留余量或采用更大额定电压/更大体积器件。
- 若要求严格温度线性或超低损耗，应考虑C0G/NP0类陶瓷或薄膜电容替代。
- 订购时确认完整料号、包装规格与批次测试记录，必要时索取样品与参数曲线（包括DC bias曲线）。
如需器件的具体直流偏压特性曲线、损耗角正切（DF）、耐温老化曲线或推荐焊盘图，请告知，我可以帮您获取并整理成图表供工程评估。
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