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HRE CGA0805X6S475M350MT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X6S475M350MT
- Type
- HRE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X6S475M350MT
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.038g
- Electronic Component
- 1
- Electronic Component
- BM0264778569
- Electronic Component
- X6S
- Voltage
- 35V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X6S475M350MT 产品概述
一、产品简介
CGA0805X6S475M350MT 为 HRE（芯声）系列贴片多层陶瓷电容（MLCC），规格为 0805 封装，标称电容 4.7µF，公差 ±20%，额定电压 35V，介质温度特性为 X6S。该器件以微小体积提供较高的容值，适用于对体积和性能有均衡要求的表面贴装电路。
二、主要参数
- 型号：CGA0805X6S475M350MT
- 容值：4.7µF
- 公差：±20%
- 额定电压：35V
- 介质：X6S（温度特性）
- 封装：0805（约 2.0mm × 1.25mm）
- 品牌：HRE（芯声）
三、关键特性与电气行为
- 体积小、容量密度高，适合空间受限的移动设备与消费类电子。
- 采用 X6S 陶瓷介质，强调在较宽温度区间内的容量稳定性和长期可靠性。
- MLCC 具有较低 ESR/ESL 的天然优势，适用于电源去耦与高频旁路。
- 需注意直流偏压效应：高介电常数陶瓷在施加直流电压时容量会下降，接近额定电压时下降更明显，选型时应参考厂方的 DC-bias 曲线与温度特性图。
四、典型应用场景
- 电源去耦与旁路（DC-DC 转换器输入/输出、LDO 降噪）
- 滤波与稳定电路（模拟与数字电源轨）
- 消费电子、工业控制、通信设备及便携仪器等对 35V 以内电源需要较大旁路电容的场合
五、封装与加工建议
- 0805 封装便于高速贴片与自动化回流焊工艺，兼容无铅回流温度曲线（典型回流峰值温度 ≤ 260°C）。
- 布线建议：电源旁路处尽量缩短从电容到电源引脚/地的走线，减小寄生阻抗。
- 机械应力管理：贴片陶瓷电容对 PCB 弯曲和热机械应力较敏感，焊盘设计与焊膏量要符合厂方推荐以降低开裂风险。
- 储运与处理：长期暴露于高湿环境或严重湿度循环前可按厂方建议进行干燥处理。
六、选型与可靠性建议
- 在关键电源轨或对容量稳定性要求高的场合，应考虑 DC-bias 与温度下的实际可用容量，必要时通过串并联组合或选用更低损耗介质（如 X7R、C0G）来满足性能要求。
- 对可靠性与寿命有严格要求的产品，建议与供应商确认产品的工艺认证与可靠性测试数据（包括温度循环、湿热、机械冲击等）。
七、订购与技术支持
完整料号为 CGA0805X6S475M350MT，HRE（芯声）可提供样片、卷带包装及批量供应。具体包装形式、最小订购量及最新数据手册请联系 HRE（芯声）或其授权代理商获取，以便获得 DC-bias 曲线、温度特性图和详细焊接建议。
如需进一步的电路应用建议（布板示例、并联策略或失效分析），可提供 PCB 拓扑与工作条件，我方可协助评估并给出优化方案。
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