WMSIC Electronic Components

HRE CSA1206M3L683J500MT

ModelCSA1206M3L683J500MT
Package1206
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
HRE CSA1206M3L683J500MT
Type
HRE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CSA1206M3L683J500MT
Electronic Component
1
Electronic Component
68nF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.046g
Electronic Component
1
Electronic Component
BM0264778596
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CSA1206M3L683J500MT 产品概述

CSA1206M3L683J500MT 是 HRE(芯声)品牌的一款多层陶瓷贴片电容(MLCC),标称电容值 68 nF,容差 ±5%,额定电压 50 V,1206 封装(3216 公制尺寸)。该器件适用于常见的去耦、滤波、交流耦合与 RC 网络场合,兼顾体积与电气性能,便于在中小功率电源与模拟电路中广泛应用。

一、主要电气参数

  • 容值:68 nF(683 表示 68×10^3 pF)
  • 精度:±5%(J)
  • 额定电压:50 V DC
  • 类型:多层陶瓷贴片电容(MLCC)
  • 封装:1206(英寸 0.12×0.06,公制约 3.2×1.6 mm)

二、典型特性与优势

  • 小体积、高容积效率:1206 封装在有限 PCB 空间内提供较高的电容值,利于电路紧凑化。
  • 低串联电阻与感抗:适合高频去耦与噪声抑制,能提升电源瞬态响应。
  • 工艺稳定、批量一致性好:适合 SMT 生产线直接回流焊装配。
  • 可靠性高、寿命长:在推荐工况下表现稳定(具体寿命与介质类型和应用环境相关)。

三、使用限制与注意事项

  • DC 偏压与温度影响:多数高介电常数陶瓷随直流电压和温度会出现容量下降,关键电路应按实际工作电压下测量有效容量后选型。
  • 机械应力敏感:贴片陶瓷电容对焊接冷却收缩或 PCB 弯曲可能产生裂纹,布板时避免置于边缘或受应力区域,焊盘设计与丝印胶固定要合理。
  • 回流焊工艺:兼容无铅回流,但应参考厂方回流曲线与 IPC 指南,必要时进行预烘烤以避免湿度引起的焊接问题。

四、典型应用场景

  • 开关电源和线性稳压模块的输入/输出去耦
  • 高频滤波与 EMI 抑制(与电感、电阻配合)
  • 模拟前端的耦合/旁路电路(音频、传感信号)
  • 定时与 RC 网络(当需 68 nF ±5% 时)

五、选型建议

  • 若电路对容量稳定性要求高(温漂极小),应确认具体介质材料(如 C0G/NP0 与 X7R/X5R 差别),必要时向厂商索要温度/频率/偏压曲线。
  • 对于电源去耦,建议并联不同容值与不同封装的 MLCC 以覆盖宽频带去耦需求。
  • 关注焊盘设计与 PCB 支撑,遵循厂方推荐的焊盘尺寸和回流参数以降低裂纹风险。

六、储存与可靠性维护

  • 避免潮湿长期暴露,未使用的卷盘应密封保存并按厂家建议回流前进行烘烤。
  • 装配后避免强烈机械冲击与过度热循环,必要时做环境应力筛查(HAST、温度循环)以匹配产品寿命要求。

总结:CSA1206M3L683J500MT 是一款适用于多场合的 68 nF/50 V MLCC,兼具通用性与装配便利性。实际应用时请结合介质温漂、DC 偏压特性及厂方具体数据进行验证与布板优化,以获得最佳电气与可靠性表现。若需更详细的温度/频率/偏压曲线、机械尺寸图与回流曲线,可向 HRE(芯声)索取完整规格书。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.