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HRE CGA0603X7R331K500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R331K500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R331K500JT
- Electronic Component
- 1
- Electronic Component
- 330pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264743652
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R331K500JT 产品概述
一、产品简介
CGA0603X7R331K500JT 是 HRE（芯声）出品的一款贴片多层陶瓷电容，额定容量为 330 pF，容差 ±10%，额定电压 50 V，介质材料为 X7R。0603（英制）封装尺寸小巧，适配高密度贴装的现代电子产品，定位为通用型中频/旁路、滤波与耦合应用的解决方案。
二、主要规格与性能
- 容值：330 pF（标称）
- 容差：±10%（K）
- 额定电压：50 V DC
- 介质：X7R（温度系数在 -55°C 到 +125°C 范围内典型变化不超过 ±15%）
- 封装：0603（1608 公制）片式封装
X7R 材料在温度稳定性与体积容值之间取得平衡，提供较高的容值与良好的介电强度，适合一般去耦与滤波。需注意 X7R 存在温度依赖性和电压依赖性（直流偏压下容量会下降），在要求高准确度和极低漂移的场合应选择 NP0/C0G 型陶瓷。
三、封装与机械特性
0603 小封装利于高密度 PCB 布局，焊接兼容常见无铅回流工艺。外观规则、尺寸公差符合行业标准，适合自动贴装生产线。建议在设计时给予焊盘合理尺寸与应力缓解区域，以降低温度循环与机械应力对电容性能的影响。
四、典型应用场景
- 电源去耦与中频滤波
- 信号耦合与旁路电路
- 模拟前端滤波与振荡回路（非高精度时钟源）
- 消费电子、通信设备、工业控制模块及车载电子等需要小体积与中等稳定性的应用
五、选型与使用建议
- 若电路对温漂、温度系数和电压系数敏感（如高精度计时或高稳定振荡器），优先考虑 NP0/C0G 类型；一般去耦与滤波场合 X7R 为成本与性能的折中选择。
- 直流偏压会引起 X7R 容值下降，设计时需留有裕度；若在接近 50 V 的工作电压下使用，应通过样件测量实际 dc-bias 下的有效容量。
- 对温度循环和机械冲击敏感的应用，注意 PCB 布局与焊接工艺对元件应力的影响，必要时采用应力缓解设计。
六、焊接与存储建议
- 遵循通用无铅回流曲线，峰值温度建议 ≤ 260°C，按厂家回流工艺规范控制加热/冷却速率与浸润时间。
- 储存时保持干燥包装，避免长期潮湿环境；如超过推荐储存期或发生水分吸收，应按厂商建议进行干燥处理（烘烤）后再使用。
七、可靠性与检测
HRE（芯声）出品的该系列通过常规的电气与环境可靠性测试，包括耐压、绝缘电阻、温度循环及焊接热稳定性检测。实际项目中建议结合批量样件做工况验证（温度、偏压、频率条件下的容量漂移与损耗角正切测量），以确保长期稳定性满足设计要求。
如需器件详细 datasheet、回流曲线或样品测试报告，请提供采购数量或测试条件，我方可协助获取或安排技术支持。
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