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HRE CSA1206C0G100J102MT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA1206C0G100J102MT
- Type
- HRE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA1206C0G100J102MT
- Electronic Component
- 1
- Electronic Component
- 10pF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.041g
- Electronic Component
- 1
- Electronic Component
- BM0264596064
- Electronic Component
- C0G
- Voltage
- 1kV
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA1206C0G100J102MT 产品概述
一、产品简介
CSA1206C0G100J102MT 为 HRE(芯声) 推出的高压高稳定性多层陶瓷片式电容，尺寸为 1206 封装，标称电容 10 pF，容差 ±5%，额定电压 1000 VDC，介质为 C0G（亦称 NP0）。该型号定位于需要极低温漂、低损耗和高可靠性的精密电子电路。
二、主要电气性能
- 容值：10 pF ±5%（J）
- 额定电压：1000 VDC（高压等级，适合中高压应用）
- 温度系数：C0G（近似零温漂，温度稳定性优良）
- 低介质损耗与低介质吸收，适合对相位和频率稳定性要求高的场合。
三、材料与结构特点
采用 Class 1 陶瓷（C0G/NP0）材料，介电常数稳定、介质损耗小。1206 贴片体积与机械强度在保证高压能力的同时，兼顾可焊性与自动贴装。为达到 1 kV 电压等级，内部结构经过强化设计以控制击穿和沿面放电风险。
四、典型应用场景
- 高频振荡与滤波电路、频率整定元件
- 射频前端、阻抗匹配与耦合元件
- 高压测量、耦合与隔离电路
- 精密定时与参考电路，需要长期稳定性的场合
五、布局与焊接建议
- 在高压应用中，PCB 设计需满足相应的爬电距离与间隙要求，遵循相关安全标准；通常应留出足够的间距并避免高压轨与其他信号线近邻。
- 支持无铅回流焊工艺；请根据工厂提供的回流曲线进行焊接（通常峰值温度≤260°C，控制回流时间），避免反复回流和过热导致机械应力。
- 为减少电容电压系数与寄生影响，靠近敏感电路放置并注意走线短而粗。
六、可靠性与存储
C0G 材料稳定性高，长期漂移小。存储时应防潮、防尘、避免长时间暴露在高温或强腐蚀性气体环境中。出厂通常采用卷带盘装，适用于贴片机自动化装配。
七、选型提示
在 1 kV 应用下，应注意器件在实际工作电压下的电容变化、绝缘电阻和击穿裕度，必要时参考厂方详细资料或进行实际测试。若有更高电压或更大容值需求，可与供应商沟通替代型号或多颗并联/串联方案。
如需样片、详细规格书或可靠性测试报告（如温度循环、湿热及高压保持测试），建议联系 HRE(芯声) 或授权分销渠道获取完整数据与应用支持。
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