WMSIC Electronic Components

HRE CGA0603X5R226M100JT

ModelCGA0603X5R226M100JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0603X5R226M100JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0603X5R226M100JT
Electronic Component
1
Electronic Component
22uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.027g
Electronic Component
1
Electronic Component
BM0264495344
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0603X5R226M100JT 贴片多层陶瓷电容(MLCC)产品概述

CGA0603X5R226M100JT是HRE(芯声)电子推出的通用型贴片多层陶瓷电容(MLCC),针对消费电子、小型家电及低功耗工业场景优化设计,具备体积小、容量稳定、可靠性高的特点,是主流低压电路滤波、耦合的理想选型。

一、产品基本定位

该型号属于0603封装(英制0603/公制1608) 通用MLCC,核心定位为低压小容量稳定型电容,覆盖-55℃~+85℃宽温度范围,兼容多数中低端电子设备的常规电路需求,无需特殊定制即可适配批量生产。

二、核心技术参数详解

参数项 具体参数 说明 容量(C) 22μF 型号中“226”表示(22×10⁶pF=22μF),中等容量范畴 精度 ±20%(代码M) EIA标准精度,满足消费电子类电路容量误差要求 额定电压(VR) 10V(直流) 型号中“100”对应10V,交流额定电压需降额至约7V(10V×0.7) 温度系数/材质 X5R 工作温度-55℃~+85℃,容量变化±15%,兼顾稳定性与成本 封装尺寸 0603(1.6×0.8mm) 贴片封装,厚度约0.5~0.8mm(工艺略有差异) 品牌/型号前缀 HRE/CGA CGA为通用贴片MLCC前缀,HRE芯声为专业陶瓷电容厂商

三、材料与性能特性

  1. X5R材质核心优势:
    相比Y5V材质(容量变化±22%),X5R温度稳定性提升30%以上,可保证设备在-20℃+60℃(消费电子典型工作温度)范围内容量波动极小;相比X7R材质(-55℃+125℃),X5R成本降低约15%,适合非极端高温场景。

  2. MLCC结构特性:
    采用多层陶瓷叠层+银/镍电极结构,容量/体积比达传统铝电解电容的5~10倍,0603封装可替代更大体积的电解电容,显著缩小PCB面积;无极性设计(无正负引脚),焊接效率提升30%以上。

  3. 可靠性指标:
    符合AEC-Q200(汽车级)基础标准,平均无故障时间(MTBF)超100万小时;耐焊接冲击(回流焊峰值温度245℃下无开裂),抗机械振动(10~2000Hz下无失效)。

四、典型应用场景

  1. 移动终端:
    智能手机/智能手表的电源管理模块(PMIC)滤波(滤除5V/3.3V电源纹波)、音频耦合电路(传递麦克风/扬声器信号)、无线模块(蓝牙/WiFi)旁路(滤除高频干扰)。

  2. 小型家电:
    智能遥控器按键电路滤波(消除按键抖动干扰)、加湿器控制板电源滤波、智能台灯LED驱动电路旁路。

  3. 低功耗工业设备:
    户外传感器节点信号滤波(适应-20℃~+60℃环境)、无线抄表模块匹配电路、小型PLC辅助电源滤波。

  4. 汽车辅助电子:
    车载USB接口EMI滤波(满足-40℃~+85℃车载温度)、倒车雷达辅助电路旁路。

五、选型与使用优势

  1. 性价比平衡:
    X5R材质+0603封装的组合,在“温度稳定性-成本-体积”三者间达到最优平衡,比X7R型号成本低10%~15%,比Y5V型号稳定性高20%。

  2. 批量适配性:
    0603是行业主流小封装,兼容90%以上消费电子PCB设计;参数(22μF/10V)覆盖80%以上低压通用电路,无需特殊定制,采购周期缩短至3~7天。

  3. 品牌可靠性:
    HRE芯声具备10年以上MLCC生产经验,产品一致性(容量偏差≤±18%)优于行业标准,批量供货稳定,符合RoHS 2.0、REACH环保要求。

六、注意事项与存储要求

  1. 焊接工艺:
    优先采用回流焊,峰值温度控制在240~250℃(持续时间≤10秒),避免手工焊接(易导致陶瓷层开裂);焊接后禁止弯曲PCB(曲率半径≥5cm)。

  2. 降额使用:
    实际工作电压建议不超过额定电压的80%(即≤8V),可延长寿命2~3倍;若用于交流电路,需按VR(AC)=VR(DC)×0.7计算(即≤7V)。

  3. 存储条件:
    未开封产品存储温度-40℃~+60℃,相对湿度≤60%;开封后建议1个月内使用完毕,若暴露在湿度>60%环境超过24小时,需在120℃下烘烤4小时(防止吸潮导致爆米花效应)。

该型号凭借稳定的性能、紧凑的体积及高性价比,成为消费电子领域低压通用电路的核心选型之一,可满足多数常规电子设备的滤波、耦合、旁路需求。

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