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HRE CGA0805X7R102K251KT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X7R102K251KT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X7R102K251KT
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0264743637
- Electronic Component
- X7R
- Voltage
- 250V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X7R102K251KT 产品概述 — HRE(芯声)
一、产品简介
CGA0805X7R102K251KT 为 HRE(芯声) 系列贴片多层陶瓷电容（MLCC），额定容量 1nF，公差 ±10%，额定电压 250V，介质类型 X7R，封装尺寸 0805（约 2.0 × 1.25 mm）。该型号针对中高压、小封装电路的旁路、耦合与滤波应用进行优化，兼顾体积与耐压特性，适合 SMT 自动贴装生产线。
二、主要电气与温度特性
- 容值：1 nF（标称）
- 容值公差：±10%（常温）
- 额定电压：250 V DC
- 介质：X7R（工作温度范围 -55°C 至 +125°C，温度引起的容量变化通常在 ±15% 以内）
- 封装：0805（常见厚度 ~0.8–1.0 mm，具体尺寸请以成品实测为准）
- 特性：低 ESR/低 ESL（相对有利于高频滤波），陶瓷介质固有的自谐特性需在高频设计时留意
三、性能与应用建议
- 常用场景：高压旁路/去耦、EMI 滤波、脉冲抑制、耦合/去耦电路、阻尼/吸收网络以及某些高压定时/脉冲线路。
- 直流偏置效应：X7R 类型在施加高电压时会出现一定的容量下降（DC bias），250V 工作点下建议参考厂商的 DC-bias 曲线并在电路仿真/样机验证后选型。
- 温度稳定性：X7R 对比 C0G/NP0 在温度与频率下的稳定性较差，但容量密度更高，适用于对温度绝对稳定性要求不极端的场合。
四、封装、装配与可靠性注意事项
- 封装与包装：标准 SMT 晶带卷盘包装，适配常见贴片机。常见卷盘规格为 7" 或 13"，数量视包装规格而定。
- 回流焊：建议采用符合无铅回流的温度曲线，避免过长高温暴露，防止内部裂纹或电性能退化。
- 机械应力：陶瓷电容易受 PCB 弯曲或不均匀应力影响导致裂纹，布线与焊盘设计应避免过大应力集中；贴装后不能强力挤压或弯曲。
- 储存与预处理：湿敏等级视供应商定义，长期暴露后可能需要烘烤以避免回流时湿汽爆裂。
五、选型要点与替代方案
- 若电路对温度与频率稳定性要求极高，请优先考虑 C0G/NP0；若体积与成本受限且对稳定性容忍度较高，X7R 为折中选择。
- 注意比对实际工作电压下的有效容量（考虑 DC-bias）与额定公差，必要时在设计中保留裕量或并联多个电容以提高稳定性与可靠性。
本产品为 HRE(芯声) 系列中适用于中高压小封装场合的通用型 MLCC，建议在最终设计前结合实际工况（温度、频率、直流偏置与机械应力）进行样机验证。若需更详细的温度特性曲线、DC-bias 曲线或封装尺寸图，请提供需求以便获取厂方数据手册。
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