WMSIC Electronic Components

HRE CSA0603X7R471K500JT

ModelCSA0603X7R471K500JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CSA0603X7R471K500JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CSA0603X7R471K500JT
Electronic Component
1
Electronic Component
470pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264495044
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CSA0603X7R471K500JT 产品概述

一、产品简介

CSA0603X7R471K500JT 为 HRE(芯声)系列贴片多层陶瓷电容(MLCC),规格为 0603(1608公制),标称电容 470pF,初始容差 ±10%,额定电压 50V,介质为 X7R。该型号面向通用电子设计,兼顾体积小、频率响应好、成本低等特点。

二、主要性能特点

  • 额定容值:470pF;初始容差:±10%(K)
  • 额定电压:50V DC,适用于中低压电路
  • 温度特性:X7R(-55°C 至 +125°C,温度变化下容值变化范围按规格书)
  • 封装尺寸:0603,适合高密度贴装与小型化产品
  • 低等效串联阻抗,寄生电感小,自谐频率较高,适合高频旁路/滤波

三、设计与使用注意事项

  • 温度与直流偏置影响:X7R 属于 II 类介质,随温度与直流偏置会产生容值漂移,设计时应评估实际工作条件下的有效电容。
  • 频率特性:470pF 在高频区能提供良好旁路效果,但实际表现受封装与布局影响,关键电路建议在板上验证。
  • 机械应力敏感:陶瓷电容对焊接应力、板弯曲较敏感,避免在板边缘和高应力区域直接贴装,推荐合理焊盘设计与过孔分布以减少应力集中。

四、焊接与可靠性建议

  • 遵循制造商推荐回流焊曲线(常见无铅回流峰值温度约 245–260°C,实际以规格书为准)。
  • 建议使用带卷包装(Tape & Reel)便于 SMT 贴装;储存和贴装前避免长时间潮湿暴露,如有必要按厂家要求进行干燥处理。
  • 常规适用环境下稳定可靠,关键可靠性指标(如温度循环、湿热测试、寿命测试)请参考出货规格书或索取认证报告。

五、典型应用

适用于电源旁路、去耦、滤波、耦合/隔直、谐振网络与部分高频电路中的旁路元件,也常见于通信、消费电子、工业控制与汽车电子的非关键电路(若用于汽车需确认 AEC 等级)。

结语:CSA0603X7R471K500JT 是一款性价比高的通用型 MLCC,适合大规模 SMT 生产与常见电子应用。选型时请结合电路工作频率、温度范围与直流偏置效应,并以最新规格书为准,或向 HRE(芯声)供应商获取样片进行板级验证。

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