Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805F104Z500CT 为华新科(Walsin)生产的一款片式多层陶瓷电容(MLCC),标称电容值 0.1µF(100nF),额定电压 50V,温度特性等级 Y5V,封装为 0805(2012 公制)。该型号常见于大众消费电子与成本敏感的滤波、去耦场合,属于价廉且体积小的通用型电容器。
Y5V 为类 2 电介质,特点是单位体积电容较高但温度稳定性和线性较差。该电容在温度变化与直流偏置下电容值会发生显著变化,可能出现在低温或高偏压时容值降低或增大的情况。对于对精度、温漂和直流偏置敏感的电路(计时、精密滤波、频率决定网络),不推荐使用 Y5V 系列;若用于去耦、旁路或一般滤波,性能与成本通常可接受。需注意在接近额定电压时电容实际有效值会显著下降,设计时请预留裕量或通过实测评估。
0805(2012)SMD 封装适合自动贴片与回流焊装配。典型外形尺寸约 2.0 mm × 1.25 mm,厚度随厂商设计略有不同。推荐采用厂商提供的 PCB 推荐焊盘(land pattern)与回流曲线进行贴装,遵循无铅回流峰值温度(典型 ~260°C)及厂方湿敏(MSL)处理要求,以避免裂纹或性能退化。
厂家会提供加速老化、温度循环与机械应力等可靠性测试数据。芯片电容易受机械应力影响,存储与贴装前应按湿敏等级保管并在规定时间内回流,避免长时间潮湿环境导致焊接缺陷或裂纹。
总结:0805F104Z500CT 为一款成本效益高、体积小的 Y5V 陶瓷电容,适合一般去耦与滤波应用;但在对精度、温漂与直流偏置敏感的场合需谨慎选型或替换为更稳定的陶瓷介质。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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