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Infineon BAS4005E6433HTMA1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Infineon BAS4005E6433HTMA1
- Type
- INFINEON
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- BAS4005E6433HTMA1
- Electronic Component
- 1
- Package
- SOT-23-3
- Electronic Component
- Schottky Diode
- Electronic Component
- Signal =< 200m A(Io)
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- BM0264221709
- Type
- Surface Mount
- Diode Type
- Electronic Component
- Diode
- 1
- Operating Temperature
- 150°C
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS4005E6433HTMA1 产品概述
一、概述与主要参数
BAS4005E6433HTMA1 是英飞凌（Infineon）推出的一款双芯共阴极肖特基二极管，采用 SOT-23-3 表面贴装封装。器件针对低电平和小功率整流应用优化，主要电气参数包括：正向电压 Vf = 1.0V @ If 40mA，最大反向电压 Vr = 40V，单二极管平均整流电流 Io = 120mA（直流），反向漏电流 IR ≈ 1µA @ 30V，反向恢复时间 trr ≈ 100ps，结温最高可达 150°C。
二、关键特性与优势
- 低正向压降：1V 在 40mA 条件下，可降低功耗并改善效率，适合电池供电与便携设备。
- 极短恢复时间：trr 约 100ps，适合高速开关与信号整流场合，减少反向恢复导致的开关损耗与干扰。
- 低泄漏电流：30V 条件下约 1µA，适用于低静态功耗场景。
- 紧凑封装：SOT-23-3 小尺寸利于高密度 PCB 布局与自动贴装生产。
- 双芯共阴极：便于实现双路整流、功率路径选择（diode-ORing）或保护电路的集成设计，节省空间与焊盘。
三、典型应用场景
- 便携式与手持设备的低压整流与电源保护。
- 快速切换电路、脉冲信号检测与钳位保护。
- 二极管 OR-ing、反接保护与电源路径自动切换。
- 高速开关电源的次级整流（低功率段）及信号隔离与整形电路。
四、布局与热管理建议
- 虽为小功率器件，但在靠近热源或高占空比工作时需注意结温升高，尽量保证良好散热路径与靠近地平面的铜箔。
- 引脚焊盘与走线应尽量短且宽，减少寄生电感与电阻，有利于高速切换性能与热耗散。
- 对于高频或敏感信号，布局上应避免长引线共面，必要时加旁路电容或 RC 抑制网络以降低噪声。
- 推荐在规格条件下按温度降额使用，确保长期可靠性。
五、封装与使用注意
- 封装：SOT-23-3，适配常见贴片工艺，便于自动化装配。
- 品牌与型号：Infineon BAS4005E6433HTMA1。采购时注意批次与湿度敏感等级（MSL），并遵循回流焊工艺规范。
- 可靠性：遵守最大结温与最大反向电压限制，避免长时间近极限工况，以保证器件寿命与系统稳定性。
该器件在体积受限且需要低正向压降、快速响应的低功率整流与保护应用中表现优秀，是实现高密度电源管理和信号整形的理想选择。
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