Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Infineon IRF7306TRPBF
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Infineon IRF7306TRPBF
- Type
- INFINEON
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- IRF7306TRPBF
- Electronic Component
- 1
- Package
- SO-8
- Electronic Component
- 2 P
- Electronic Component
- MOSFET
- Electronic Component
- 0.14g
- Electronic Component
- 1
- Electronic Component
- BM0264462376
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
- Voltage(Vdss)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
IRF7306TRPBF 产品概述
概述
IRF7306TRPBF 是一款由德国著名半导体制造商英飞凌（Infineon）推出的高性能场效应管（MOSFET），属于双P沟道器件。凭借其优异的电气性能和可靠性，IRF7306TRPBF 在功率管理、开关电源、电机驱动等应用领域得到了广泛使用。
主要参数
IRF7306TRPBF 具备以下关键参数：
- FET 类型：双P沟道
- FET 功能：逻辑电平门
- 漏源电压（Vdss）：30V
- 连续漏极电流（Id）：3.6A @ 25°C
- 最大导通电阻（Rds(on)）：100毫欧 @ 1.8A，10V
- 门源阈值电压（Vgs(th)）：最大值为1V @ 250µA
- 栅极电荷（Qg）：最大值为25nC @ 10V
- 输入电容（Ciss）：最大值为440pF @ 25V
- 最大功率：2W
- 工作温度范围：-55°C ~ 150°C
- 封装类型：8-SOIC（0.154", 3.90mm 宽）
电气特性
IRF7306TRPBF 的电气特性使其在高频开关应用中表现出色。其最大漏源电压为30V，适合用于中等电压的应用。该器件的连续漏极电流为3.6A，且具有较低的导通电阻（最大值为100毫欧），使得在较大的电流下依然可以保持较低的功率损耗。这样就可以显著提高电能的管理效率，减少热量产生，增加系统的稳定性和可靠性。
高频性能
该器件的栅极电荷（Qg）为25nC，在相对较低的驱动电压（10V）下提供了良好的开关特性，有助于实现快速开关。这意味着在 PWM（脉宽调制）驱动和高频开关电源中，IRF7306TRPBF 可以有效提升开关速度，降低开关损耗。
工作环境
IRF7306TRPBF 设计用于宽温度范围的应用，其工作温度从-55°C 到 150°C，适应了严苛环境中的应用需求，如航空航天、汽车电子及工业自动化设备等。这一广泛的工作温度范围确保了器件的高可靠性和耐用性，在极端条件下也能正常工作。
封装及安装
IRF7306TRPBF 采用 8-SOIC 封装，具有小型化和表面贴装的特点，使其在空间受限的设计中应用广泛。由于其轻巧的设计，8-SOIC 封装的器件在电路板上的布局设计上也更为灵活，便于自动化装配。
应用领域
IRF7306TRPBF广泛应用于各种低压、高电流的场合，包括：
- 开关电源设计
- 电机控制驱动
- 直流-直流转换器
- 射频功率放大器
- 照明控制系统
- 汽车电力分配及管理系统
结论
IRF7306TRPBF 的双P沟道结构、出色的电气性能、宽工作温度范围，以及灵活的封装设计，使其成为高效能和高可靠性应用中的理想选择。无论是在家用电器、工业自动化，还是高频开关电源的设计中，IRF7306TRPBF均能够满足现代电子设备对性能与效率日益增长的要求。如果您正在寻找一款可靠的MOSFET解决方案，IRF7306TRPBF是一个极具吸引力的选项。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
